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(Click for frequent words.) 73 #μm [002] 73 5μm 72 #μm [001] 72 #.#in [004] 72 #.#μm [001] 71 1μm 70 #.#um [001] 70 cm ² 70 μm diameter 69 #.#mm [002] 69 Si substrate 69 2μm 69 #.#nm [002] 68 μm 68 #um [001] 67 #.#mm x [003] 67 #μ 66 SMT LEDs 66 PBGA package 66 #x#mm [005] 65 conductive epoxy 65 hafnium oxide 65 mm ² 65 x 9mm 65 #nm #nm [002] 65 C0G 65 μm thick 65 cm -2 65 voltage divider 65 input capacitance 65 QFPs 65 1mm x 1mm 65 capacitance values 65 4mm x 65 4mA 64 x 1mm 64 #.#pF 64 resistive element 64 z axis 64 5mm x 5mm 64 x 7mm 64 microcavity 64 coplanar 64 #mm ² [001] 64 monochromator 64 2nm 64 5mm x 64 #mm# [002] 64 magnetostrictive 64 QFNs 64 mu m 64 #pF [001] 64 wirewound 64 #x# mm [003] 64 #nm wavelength [001] 64 nitrided 63 W mK 63 mm BGA 63 1W LED 63 7mm x 63 BGA packages 63 x #.#mm [005] 63 bandpass filter 63 #.#mm diameter [002] 63 FBGA package 63 chamfer 63 MΩ 63 x 3mm 63 #nm laser [002] 63 surface mountable 63 HV# [003] 63 absorption coefficient 63 shaft diameters 63 pin 4mm x 63 mosfet 63 hardcoat 63 PQFP 63 #mm# [001] 63 subwavelength 63 6mm x 6mm 63 electrically insulating 63 bandpass 63 subminiature 63 7 x 7mm 63 x 2mm 63 #.#mm x #.#mm [001] 63 #x# mm [004] 63 radial leaded 63 X7R 63 3mm x 63 #.#Hz 63 5V CMOS 62 1nm 62 solder bumps 62 wirebond 62 meV 62 SiO 2 62 #.#x#.#mm 62 linear encoder 62 lamella 62 HMC#LP#E 62 isotropic 62 micron thick 62 coating thickness 62 emission wavelength 62 lowpass filter 62 Nd YAG 62 #-#,# mm 62 #mm x 62 #.#mm x [002] 62 solderable 62 coplanarity 62 OP# [003] 62 #.#μ 62 dimensional tolerances 62 optical encoder 62 6mm x 62 #:#.#-#.# 62 3mm 62 #mm x #.#mm [002] 62 silica spheres 62 Silicon Nitride 62 dielectric strength 62 #.#mm x #.#mm [003] 62 Nova NanoSEM 62 bending radii 62 pin BGA package 62 dielectric constant 62 × #mm [002] 62 ohm cm 62 GaN layer 62 TiN 62 micron 62 QFN packages 62 InGaAs 62 #lm [002] 62 #.#mm diameter [001] 62 mounting flange 62 InAs 62 thermal impedance 62 TDFN packages 62 5nm 62 linewidths 61 SiO2 61 1kV 61 triaxial 61 #.#mm# [002] 61 QMEMS 61 mW/cm2 61 Exoscan 61 tiny 3mm x 61 capacitances 61 pMOS 61 DFN package 61 #.#Ω 61 #mm x #mm [007] 61 electroless nickel 61 submicron 61 ferrite core 61 micromachined 61 4 x 4mm 61 microlens 61 #μm thick [002] 61 dielectrics 61 tensile modulus 61 microstrip 61 aspherical lens 61 toroidal 61 x 5mm 61 1mm thick 61 PIN photodiode 61 4mm x 4mm 61 illuminance 61 #.#mm x [001] 61 elastic modulus 61 singlemode 61 milliohm 61 .8 mm 61 beamsplitters 61 dual damascene 61 millimeter mm 61 ZnSe 61 compressive stress 61 x 3cm 61 #.#mm x #.#mm [002] 61 6mm 61 #x#mm [002] 61 subrack 61 AFM probes 61 collimated 61 Schottky rectifiers 61 bipolar transistors 61 planarity 61 8mm diameter 61 aluminum heatsink 61 x 4mm 61 #.#kV [001] 61 ohmic 61 +# deg [002] 61 phototransistors 61 4mm thick 61 #ksps 61 sq. mm 61 epiwafers 61 infrared LEDs 61 MBd 61 nm wavelengths 61 #.#mm x [004] 61 #.#mm thick [002] 61 amperometric 61 LiNbO3 61 UV VIS 61 ppm ° C 61 3nm 61 #nm #nm [001] 61 FWHM 61 inductive sensor 61 -# ° [002] 61 4H SiC 61 DFN packages 61 #nm laser [001] 61 pin TSSOP 61 stripline 61 temperature coefficient 61 PIN photodiodes 60 DFB lasers 60 BGA package 60 SMD LEDs 60 wirewound resistors 60 metallisation 60 WL CSP 60 #.#mm x #.#mm x [002] 60 dielectric layer 60 ZrO 2 60 pin TSSOP package 60 #ohm [001] 60 numerical aperture NA 60 toroid 60 PEEK OPTIMA 60 narrow bezel 60 InSb 60 3mm DFN package 60 thermally stable 60 pyrometer 60 APTIV film 60 concentricity 60 x 6mm 60 Cpk 60 leadless package 60 in. dia 60 input impedance 60 nanometric 60 passband 60 #mm# [003] 60 #W halogen 60 copper metallization 60 NWs 60 #x#x#mm [001] 60 2mm 60 #x#x#.#mm [003] 60 #.#mm# [001] 60 EMCCD 60 EMIF# 60 HEMT 60 1kHz 60 #x#mm [003] 60 MSOP packages 60 eutectic 60 martensite 60 HRTEM 60 transconductance 60 torque transducer 60 Ball Grid Array 60 Z Foil 60 overmolding 60 ± #.#dB 60 femtogram 60 darkfield 60 Sitrans 60 sub micron 60 InGaN 60 collimators 60 8 pin MSOP 60 optocoupler 60 azimuthal 60 micrometer scale 60 nH 60 overmolded 60 thermal EMF 60 QSOP 60 SO8 60 absolute TCR 60 wafer dicing 60 micrometer 60 #μF [001] 60 phototransistor 60 OPTIMASS 60 1mm 60 2mm x 2mm 60 7mm x 7mm 60 resonance frequency 60 SMA connector 60 micrometre 60 transflective LCD 60 SMA connectors 60 weldability 60 LVDTs 60 pin TDFN package 60 m 60 photon detection 60 #.#mm ² 60 x #.#in [001] 60 BJTs 60 mrad 60 #lm [001] 60 mm dia 60 inductive proximity 60 W x #mm 60 AlGaAs 60 #.#mm x #.#mm [004] 60 chip resistors 59 nanometers nm 59 wavelength tunability 59 ZXLD# 59 #mm x #mm [006] 59 microlenses 59 anneal 59 conductivities 59 x #.#in [002] 59 PIN diode 59 #V ac 59 ZnS 59 accuracy repeatability 59 DFN# 59 cermet 59 crystal resonator 59 #.#mm [007] 59 brightfield 59 SOT# [002] 59 interposer 59 measuring #.#mm x [001] 59 modulus 59 #.#x#.# 59 GaAs FETs 59 3 x 3mm 59 Viewing Angle 59 piezo actuators 59 beam splitter 59 2mm x 59 Attenuator 59 mΩ 59 silicon nitride 59 transimpedance amplifier 59 BGA CSP 59 planarization 59 #Ω [002] 59 x #.#mm [001] 59 mount inductors 59 AlN 59 planetary gearbox 59 linearly polarized 59 #pin [001] 59 electret 59 Measuring #mm [002] 59 SiC substrates 59 mounting flanges 59 x 7cm 59 ± #.#mm [001] 59 mK 59 Measuring #mm [001] 59 X7R dielectric 59 absorbance 59 micron diameter 59 CdSe 59 solder bump 59 #.#mm [005] 59 #μF [002] 59 underfill 59 pin 3mm x 59 #x#x# mm [002] 59 PowerPAK 59 megohms 59 LSA#A 59 dielectric layers 59 zirconium oxide 59 reflowed 59 collimator 59 variable resistor 59 NiSi 59 microfocus 59 cm ^ sup 59 #dpi resolution [001] 59 toolholder 59 toolholders 59 cone woofers 59 PIN diodes 59 nm VCSEL 59 wafer thickness 59 #x# dpi [001] 59 magnetic separator 59 #x#mm [004] 59 dipole antenna 59 JFETs 59 fluorescence detection 59 TO #AB 59 oxide thickness 59 photodiode array 59 #mm x #.#mm [001] 59 #/#-in [001] 59 microvia 59 Fig. 2A 59 magnetic permeability 59 Bragg grating 59 5mm x 6mm 59 piezo motor 59 subnanometer 59 Transmissive 59 PQFN package 59 Mosfet 59 diode arrays 59 waveguide 59 pin SOIC packages 59 SiON 59 #mm ² [002] 59 laser resonator 59 optical waveguide 59 RGB pixels 59 exacting tolerances 59 linear axes 59 transmissivity 59 QFN# package 59 L#A [001] 59 #ppm ° C 59 hardness testers 59 isotherm 59 tunable filters 59 pin BGA 59 fused silica 59 axial leaded 59 ballscrews 59 palladium Pd 59 Vdd 59 PHEMT 59 quantum cascade 59 chipscale 59 WLCSP 59 transistor arrays 59 τ 59 8kV 59 SPDT switch 59 Cu Cu 59 pulse durations 59 W/cm2 59 wire bondable 59 Avago ACPL 59 2mm x #.#mm 59 RDS ON 59 mV V 59 PLL synthesizer 59 #x#cm [001] 59 ultrasonic transducers 59 Capacitance 59 lp mm 59 static dissipative 59 cuvettes 59 #Vdc [003] 59 Fig. 3A 59 FC# [003] 59 Bulk Metal 59 μH 59 connectorized 59 microbalance 59 ν 59 tensile strengths 59 pin LQFP 59 Z axes 59 numerical aperture 59 tight tolerances 59 mm2 59 Interferometric 59 TDFN package 59 ADIS# 59 x 8mm 59 D2PAK 58 x #in 58 #MSPS 58 durometer 58 OPTEK 58 bend radii 58 dielectric constants 58 #Msps [002] 58 surface roughness 58 micron pixels 58 ACPL #J 58 #AWG 58 9xx nm 58 Hastelloy C 58 HEMTs 58 5kV 58 tin Sn 58 instrumentation amplifier 58 #mΩ [002] 58 mask aligners 58 MIC#/# 58 incremental encoders 58 ± #V [001] 58 radiused 58 3mm x 3mm x 58 ellipsometry 58 photocurrent 58 Z axis 58 microcavities 58 #.#μm [002] 58 1mA 58 f#.# lens 58 Mbit SRAMs 58 defect densities 58 magnetron sputtering 58 2dB 58 oxide semiconductor 58 #mV [001] 58 strain gage 58 3mm x 3mm 58 OCXOs 58 1U rack 58 enthalpy 58 Agilent U#A 58 milliampere 58 2kV 58 UV stabilized 58 photon flux 58 nits brightness 58 FLD glass 58 rotary encoders 58 #.#u 58 Coriolis meters 58 Flip Chip 58 LQFP 58 2kHz 58 linearization 58 nanosecond pulse 58 #mm diameter [001] 58 Lithium Niobate 58 cuvette 58 RADSOK 58 AlGaN 58 GaN layers 58 SiGe bipolar 58 ^ sup -1 58 heterostructure 58 pin SOIC 58 CMOS transistors 58 voltage dividers 58 tiny #.#mm x 58 Inconel 58 crystallinity 58 transmissive 58 conduction cooling 58 GaN wafers 58 MESFET 58 indium gallium phosphide InGaP 58 excitation wavelengths 58 optically coupled 58 transmittance 58 Î ¼ 58 fA 58 CMOS imager 58 multimode optical fiber 58 ADXL# 58 nanopositioning stages 58 uniaxial 58 parasitic inductance 58 flexure 58 varactors 58 ISL#M 58 thermoelectric cooler 58 CMOS fabrication 58 Fractional N 58 mm f/#.# ASPH 58 parasitic capacitance 58 piezoelectric ceramic 58 MWNT 58 biaxial 58 gate electrode 58 cantilever deflection 58 carbon nanotube CNT 58 SMD LED 58 8mm x 8mm 58 SWCNT 58 #x#mm package 58 TECHSPEC 58 PWM signal 58 #bar [001] 58 #L stainless steel 58 #.#uF 58 QFN# 58 #mm x #mm x 58 solder mask 58 piezo actuator 58 QSFP connector 58 tiny 2mm x 58 isolated flyback 58 pellicle 58 micromirror 58 synchronous buck converter 58 directivity 58 photolithographic 58 #cm x 58 ratiometric 58 #pF [002] 58 numerical apertures 58 QCLs 58 Sony ICX# 58 beamsplitter 58 threshold voltages 58 TSSOP package 58 photomultipliers 58 HV# [001] 58 pin LQFP package 58 #.#μm CMOS 58 coupling capacitors 58 picolitre 58 kg hr 58 CMOS wafers 58 Gaussian beam 58 Arria GX FPGAs 58 #degC [002] 58 telephoto zoom lens 58 ksi 58 mbar 58 5ppm 58 Motionflow 58 √ Hz 58 pin TQFP 58 μV 58 #.#mV 58 mm diameters 58 TQFP 58 emitting lasers 58 linear encoders 58 1W LEDs 58 μW 58 iglide 58 +# º C [001] 58 highly conformal 58 SOIC package 58 #GHz [001] 58 rheometer 58 cm2 58 poly L lysine 58 AV2 58 ellipsoidal 58 LVDS interfaces 58 birefringence 58 pulse widths 57 #bit ADCs 57 confocal 57 arbitrary waveforms 57 photobleaching 57 optical spectrum analyzer 57 microtubes 57 SOT# package [001] 57 x #mm [001] 57 Tunable 57 Young modulus 57 MIM capacitors 57 QFP 57 CCD imagers 57 -# dBc [002] 57 photodetector 57 bending radius 57 #mV V 57 NIKKOR lens 57 #mm x #mm [001] 57 #x#x#mm [003] 57 -3 dB 57 thermowell 57 extrudate 57 TECHSPEC ® 57 1dB 57 pre preg 57 #/#-inch [002] 57 #/#Hz [001] 57 magnetic encoders 57 toroids 57 reflow soldering processes 57 transmissive LCD 57 microvolts 57 twin screw extruder 57 planar 57 UHMW 57 Datamate 57 laser interferometer 57 BGA packaging 57 microns 57 V0 57 SFP transceiver 57 gaussian 57 Mosfets 57 jitter measurement 57 1RU rack 57 #mm x #mm [002] 57 repeatability 57 pin DIP 57 #VDC [002] 57 Thermo Scientific Accela 57 excellent solderability 57 touchmonitor 57 #mA output [002] 57 MAX# integrates 57 electroformed 57 linewidth 57 nMOS 57 #m/min [002] 57 x #mm W 57 #x#x# mm [004] 57 temperature coefficients 57 magnetically coupled 57 monolithically integrated 57 RO# laminates 57 4mm x 4mm QFN 57 SiC substrate 57 RGB LED backlight 57 TRIAC 57 mount SMT 57 superior heat dissipation 57 dB insertion loss 57 Si#DP 57 ± #ppm [002] 57 ADA# 57 UV lasers 57 mV g 57 #.#VI O 57 LTPS TFT 57 aluminum nitride 57 SOT# [001] 57 wafer prober 57 FPCs 57 wetted parts 57 colorimetry 57 ohm impedance 57 imprint lithography 57 6GHz 57 mm × 57 microlens array 57 bandgap 57 silicon substrates 57 aspheric lenses 57 Mid Rail Gantry 57 PVD coated 57 DPAK 57 collinear 57 absorption spectroscopy 57 8mm thick 57 SWNT 57 aspheric 57 Foveon X3 57 dispersive 57 +4 dBm 57 shaft encoder 57 IP# sealing 57 Vrms 57 autoclavable 57 TSSOP# 57 #MS s [002] 57 #u [001] 57 MEMS resonators 57 PQFN 57 YAG lasers 57 motion adaptive deinterlacing 57 +# Vdc 57 stencil printing 57 copper interconnects 57 nanotube arrays 57 FBGA packages 57 #oC [001] 57 Printhead 57 Position Sensors 57 reticles 57 λ 57 feedthroughs 57 SOI substrates 57 DEV DA TOMAR NEXT 57 breakdown voltages 57 photodiode 57 SAW oscillators 57 circular connectors 57 #mΩ [001] 57 Akulon 57 zener diode 57 AdvancedMC module 57 NPFLEX 57 μL 57 +# ° C [002] 57 ferrite 57 RGB LEDs 57 5mm QFN package 57 MWIR 57 reflow solder 57 weld seam 57 +# oC 57 #ppm eU#O# 57 dielectric 57 SOT# package [002] 57 XFP module 57 particle sizes 57 tensile stress 57 low k dielectrics 57 sintered metal 57 x ray beam 57 thermally conductive 57 monolithic CMOS 57 #x#x#mm [002] 57 thermocouple RTD 57 HPLC columns 57 nanoribbon 57 dopant 57 titanium dome tweeter 57 thermo mechanical 57 TQFP packages 57 TLP# 57 PWBs 57 ε 57 thermowells 57 Figure 2a 57 pin QFN 57 optical sectioning 57 Mach Zehnder 57 vias 57 nitride semiconductor 57 photomultiplier tubes 57 coupled diode laser 57 beveled edges 57 magnetic encoder 57 hardfacing 57 #.#mm x [005] 57 Fig. 2a 57 μS cm 57 aspheric lens 57 incremental encoder 57 VESA mounting 57 JFET 57 CCD detector 57 PowerPAK SO 8 57 mOhm 57 OPA# [002] 57 ferrites 57 leadless 57 passivation layer 57 confocal laser scanning 57 QT# [001] 57 #ns [002] 57 #kN [002] 57 #bit ADC 57 neodymium magnet 57 ARPES 57 Cu interconnects 57 #.# micron CMOS 57 planar waveguide 57 Schematic representation 57 Fig. 2b 57 ± #ppm [001] 57 electron diffraction 57 Xenon lamp 57 consumes #.#W 57 NTC thermistor 57 InGaP 57 photoconductive 57 TQFN package 57 thermal dissipation 57 thermal conduction 57 x ray optics 57 thermally bonded 57 × #.#mm [002] 57 nonpolar GaN 57 optical waveguides 57 Schematic illustration 57 diffractive optical elements 57 excitation wavelength 57 knurled 57 TCXO 57 SOI CMOS 57 dI dV 57 x 5cm 57 8W 57 streptavidin 57 measures #.#mm x 57 Linear Actuator 57 inductance values 57 IGLOO PLUS 57 microphone preamplifier 57 viscosity fluids 57 nsec 57 antiparallel 57 AlN layer 57 WXGA #x# 57 Tx Rx 57 frequency synthesizer 57 Neodymium magnet 57 mpm 57 Fluke #A 57 3D LUTs 57 micro SMD package 57 #dB SNR [002] 57 #A #V [002] 57 UV Visible 57 silicon photonic 57 polycrystalline 57 8 pin SOIC 57 geometries 57 impedances 57 CAN transceiver 57 #μs [002] 57 S1E 56 nanomesh 56 tantalum capacitors 56 reflectometry 56 θ 56 mW cm 2 56 PE# [004] 56 #.#nm [001] 56 SAC# 56 #/#-inch [003] 56 LVDT 56 Figure 1C 56 TCXOs 56 weld seams 56 integral nonlinearity INL 56 echogenic 56 #W #W [001] 56 AdvancedMC processor 56 superlattice 56 V dc 56 mosfets 56 inertial sensor 56 3Xnm 56 SOIC 8 56 VR lens 56 #VAC [002] 56 dampens vibrations 56 Micrometer 56 anisotropic 56 g cm 56 cm sec 56 metallization 56 HORIBA Jobin Yvon 56 sputter deposition 56 Optical Surfaces 56 EDXRF 56 deformable mirrors 56 aluminum pistons 56 6mm thick 56 AEDR 56 #nm #nm [003] 56 +# dBm output 56 moisture absorption 56 servo amplifiers 56 OCXO 56 bandpass filters 56 x #.#mm package 56 Pulse Width Modulation 56 TOSAs 56 leadframe 56 Fig. 2B 56 interchangeable modules 56 mm LFCSP 56 Josephson junction 56 #/#mm [001] 56 #GB RDIMM 56 angular displacement 56 VHP# 56 PowerDI TM 56 phosphor coated 56 varying thicknesses 56 nanopositioning 56 leakage currents 56 Fig. 1d 56 mask aligner 56 x #dpi [002] 56 outer diameters 56 multilayers 56 MOSFETS 56 weld bead 56 monitor photodiode 56 outcoupling 56 dichroic 56 #x# WXGA resolution 56 Voltages 56 passivated 56 RTAX DSP 56 wph 56 microvias 56 KV2 56 fpm 56 #.#VDC 56 axially 56 undoped 56 liquid crystal polymer 56 MLPQ package