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(Click for frequent words.) 67 wafer probers 67 wafer processing 64 CMP consumables 64 line BEOL 64 wafer bumping 63 die bonder 63 line FEOL 63 wafer dicing 63 multichip 63 BEOL 63 IC packaging 62 wafer thinning 62 deep submicron 61 parasitic extraction 61 computational lithography 61 semiconductor wafer 61 FEOL 61 dielectric etch 61 EG# [002] 60 deflashing 60 wafer metrology 60 wafer 60 RFIC simulation 60 interposers 60 wirebond 60 planarization 60 VECTOR Express 60 die bonders 60 fusion splice 59 optoelectronic packaging 59 SOI CMOS 59 SiPs 59 J#Ex 59 absolute rotary encoders 59 ownership CoO 59 TestKompress 59 integrated circuits IC 59 micro machining 59 flex circuits 59 .# micron 59 QFN packages 59 leadframe 58 mount SMT 58 nanometer node 58 wafer foundries 58 #nm FPGAs 58 DongbuAnam 58 optical metrology 58 temporary wafer bonding 58 Stratix II FPGAs 58 wafer bonder 58 PCBAs 58 UltraFLEX 58 defectivity 58 capacitive sensor 58 epi wafers 58 chip SOC 58 flex rigid 58 eWLB 58 Clamp Meter 58 Sigma fxP 58 wafer prober 58 FPGA architectures 58 Automated Optical 58 Helios XP 57 SOI wafers 57 TGA# SL 57 eWLB technology 57 EUV masks 57 hermetic packaging 57 Maxtek 57 nanoimprint lithography NIL 57 package SiP 57 DCG Systems 57 microelectronic packaging 57 semiconductor wafers 57 interposer 57 Pascal Ronde 57 coupled inductor 57 nm FPGA 57 wafer scribing 57 TAS# [001] 57 reactive ion 57 HyperLynx 57 DDR PHY 57 Pseudo SRAM 57 tunable RF 57 dimensional metrology 57 microstrip 57 Arria GX FPGAs 57 silicon DRIE 57 CRIUS 57 SOI substrates 57 nano imprint 57 #.#um [001] 57 SiT# 57 SMT placement 57 Imprio 57 Farhad Hayat 57 Picogiga delivers advanced 57 MEMS oscillator 57 Macrotron 57 Calibre LFD 57 WaferPro 57 SiP 57 ETMemory 57 polishing pads 57 embedded NVM 57 monolithically integrated 57 precision metrology 57 STB# [001] 57 defect densities 57 mechanical polishing CMP 57 SO8 56 millimeter mm 56 VCXO 56 BGA packages 56 MTS# 56 MLCC capacitors 56 Aera2 56 laser scribing 56 VISIONPAD ™ 56 nm DRAM 56 customizable dataplane processor 56 micromachining 56 wire bonders 56 #v# [004] 56 fiber optic transceivers 56 #/#nm 56 design kits PDKs 56 embedded EEPROM 56 density interconnect HDI 56 GER SMH leading 56 Santur Corporation 56 transistor arrays 56 QFN packaging 56 Silego 56 optical transceiver modules 56 Ethernet-over-SONET/SDH 56 Altera Stratix III 56 #mm wafers 56 leadless packages 56 DSi etch 56 Xilinx FPGA 56 Virtex 5 56 #nm #nm [005] 56 LatticeECP3 ™ 56 VIISta 56 RFCMOS 56 photoresist strip 56 MAX# integrates 56 BGA CSP 56 DDR NAND 56 FineSim SPICE 56 Silicon wafer 56 Multitest 56 photomask inspection 56 SpecMetrix 56 AVR microcontroller 56 photoresist stripping 56 #.#μm CMOS 56 2Xnm 56 Precision Synthesis 56 selective soldering 56 #.#um CMOS 56 nm lithography 56 SiGe bipolar 56 measurement instrumentation 56 GaAs HBT 56 boundary scan 56 HardCopy II 56 #.# micron node 56 μTCA 56 embedded SerDes 56 #nm silicon 56 TDK EPC 56 FineSim Pro 56 CustomSim 56 photolithographic 56 ASIC prototyping 56 UMC #nm 56 monolithic CMOS 56 MTS #A 56 chamfering 56 silicon MEMS 56 mm wafer 56 HV CMOS 56 electromagnetic simulation 56 MEMS sensor 56 #mm ² [001] 56 ZMDI 56 nano patterning 56 Datamate 56 reticle inspection 56 semiconductor 56 ASSET ScanWorks 56 C4NP 56 Xilinx Spartan 3A 56 RedHawk SDL 56 QFNs 56 CMOS wafer 55 CMOS IC 55 triplexer 55 NLP# [001] 55 ARM7TDMI processor 55 #.#μm [002] 55 backside illumination BSI 55 InGaP HBT 55 III V epiwafers 55 indium gallium phosphide InGaP 55 nm immersion 55 linecards 55 optical subassemblies 55 Optima HDx 55 Encounter Timing System 55 Powerful debug 55 #G DPSK 55 epiwafers 55 OTDRs 55 #bit MCUs 55 Stratix II 55 CryptoRF 55 SPICE simulator 55 HSPICE R 55 Altera Stratix II 55 AEC Q# qualified 55 TLA# Series 55 Valor DFM 55 Nasdaq LTXX leading 55 #.# micron CMOS 55 XBee PRO ZB 55 #G CFP 55 #GBASE T PHY 55 Verigy V# [001] 55 MI #XM 55 ATtiny# 55 Leadframe 55 accuracy repeatability 55 holemaking 55 PCB layout 55 ZMD AG 55 workcell 55 RF Microwave 55 deep sub micron 55 introduction NPI 55 low k dielectrics 55 inertial MEMS 55 Tegal DRIE 55 millisecond anneal 55 Vdd 55 microelectronic device 55 logic analyzers 55 SMT 55 TDFN package 55 reflow ovens 55 solder paste inspection 55 Tessent 55 BGA packaging 55 nm nodes 55 pin BGA packages 55 TSMC #nm process 55 chip SoCs 55 wafer thickness 55 Actel FPGAs 55 epitaxial deposition 55 printed circuit 55 Programmable logic 55 Sequence PowerTheater 55 NPFLEX LA 55 NOR Flash memory 55 Intel IBIST 55 optical modulation analyzer 55 e beam lithography 55 Xgig 55 Keithley RF 55 WiCkeD 55 Tera Probe 55 NEXX Systems 55 #nm DRAM 55 singulation 55 TQFP package 55 nvSRAM 55 leadless package 55 CMOS MEMS 55 ARM#EJ processor 55 powerline modem 55 LabChip 55 FLCOS 55 silicon germanium SiGe BiCMOS 55 microvia 55 ultrasonic welding 55 U#A [002] 55 CMP polishing 55 sub micron 55 capacitive touch sensor 55 wafer foundry 55 XFP module 55 nm CMOS process 55 FastSPICE 55 lithography simulation 55 deep silicon etch 55 ASIC FPGA 55 MIC#/# 55 CyberDisplay #K 55 controller ICs 55 plasma etch 55 DFM DFY 55 nanometer silicon 55 ArF immersion lithography 55 JTAG Boundary Scan 55 GPON ONT 55 Actel Fusion 55 AFM probes 55 Stratix IV GX 55 SigmaQuad 55 GaAs pHEMT 55 reed switches 55 ASICs FPGAs 55 #GbE switches 55 CMOS logic 55 Actel ProASIC3 55 silicon oscillator 55 thermal dissipation 55 XT #i 55 Mixed Signal IC 55 metering ICs 55 #.#μ 55 Analog FastSPICE 55 Inovys 54 quickturn 54 STT #G 54 LPDDR2 54 Structured eASIC 54 PCI Express PHY 54 Assembleon 54 Talus Design 54 X ray microanalysis 54 RF connectors 54 DrMOS 54 FloEFD 54 MirrorBit ORNAND 54 QRC Extraction 54 1Team Implement 54 SignalExpress 54 results QoR 54 LSA#A 54 Opti Probe 54 Cadence QRC Extraction 54 robotic palletizing 54 magnetic encoders 54 Inspection AOI 54 OSAT 54 fused quartz 54 WLCSP 54 serializer deserializer SerDes 54 E#A [002] 54 #nm geometries 54 CMOS fabrication 54 photonic components 54 CMP slurries 54 #/#-nanometer 54 ion implanter 54 industrial inkjet printing 54 QorIQ P# processor 54 pin SOIC package 54 capacitors inductors 54 solder bumping 54 reflow oven 54 MirrorBit Eclipse 54 S#C# 54 MLCCs 54 EMIF# 54 CSR BlueCore5 Multimedia 54 #mm wafer 54 BCM# reference 54 Signal Analyzer 54 ML#Q# 54 reflow soldering 54 singulated 54 high-k/metal-gate 54 PIN photodiodes 54 coplanarity 54 Soitec produces 54 millisecond annealing 54 #nm immersion 54 AIX #G# 54 wafer fabrication 54 smaller geometries 54 chip SoC designs 54 LatticeEC 54 silicon 54 external EEPROM 54 phototransistors 54 linear encoder 54 nanopositioning stages 54 Integrated Circuits ICs 54 overmolded 54 pin BGA 54 silicon germanium SiGe 54 #nm node [002] 54 piezo actuators 54 PRNewswire FirstCall JDSU 54 EDXRF 54 Insulator SOI 54 Rastek UV wide 54 TriQuint Semiconductor Inc 54 TC#XBG 54 NXP SmartMX 54 Kilopass XPM 54 JTAG boundary scan 54 carbide insert 54 custom ASICs 54 MSP# MCU 54 MEMS oscillators 54 mask ROM 54 semiconductor fabs 54 parasitic inductance 54 x8 PCI Express 54 wafer uniformity 54 wafer fabs 54 Star RCXT TM 54 injection molded parts 54 silicon wafer 54 JTAG port 54 PowerPro MG 54 PoE PD 54 #:# LVDS 54 AXi 54 diode arrays 54 VISIONPAD 54 MPEG decoder 54 Ardentec 54 wafer bonding 54 1Gbit DDR2 54 NPFLEX 54 Cree GaN 54 LMX# 54 CMOS RF transceiver 54 sub Angstrom 54 analog ICs 54 overlay metrology 54 BiCMOS 54 PLL Noise Analyzer 54 3Xnm 54 Follow Vishay 54 millimeter wafer 54 SOC designs 54 MAX# MAX# [001] 54 digital multimeters 54 pcb 54 Stratix III 54 tuner demodulator 54 packaging WLP 54 ColdFire V1 54 Ixia IxNetwork 54 MirrorBit NOR 54 TrueStore 54 pin TDFN package 54 Inc. Nasdaq EGLS 54 Dektak 54 #nm FPGA 54 #nm MirrorBit 54 EasyTube 54 Agilent U#A 54 PIN diodes 54 silicon etch 54 photolithography 54 4mm x 4mm QFN 54 magnetic encoder 54 Wafer Level Optics 54 PROLITH 54 bonder 54 TCI# 54 semiconductor fabrication 54 diecutting 54 5μm 54 Xilinx Virtex 5 54 Cadence Encounter 54 ARM#E 54 SMA connectors 54 circuit MMIC 54 NanoSim 54 x 9mm 54 JFET 54 Nova NanoSEM 54 hi rel 54 zener diodes 54 HKMG technology 54 planarity 54 WinPath3 54 UHPLC 54 chipscale 54 coating laminating 54 NASDAQ LTXX 54 capacitive touch sensing 54 C0G 54 high-k/metal gate 54 stereolithography SLA 54 SurePrint 54 TDA# [001] 54 mm BGA 54 STATS ChipPAC 54 Goepel Electronic 54 RASER 54 nanometer nm NAND flash 54 solder bump 54 Stratix II GX 54 TSVs 54 epitaxial wafer 54 backplane traces 54 stripline 54 Virtuoso Multi 54 rigid flex 54 wafer foundries outsource 54 UMCi 54 Altera FPGA 54 JENOPTIK GmbH 54 AccelArray 54 conformal coating 54 AQ# [001] 54 EFEM 54 Sequans SQN# 54 DDR3 RDIMM 53 Stratix III FPGAs 53 Chemical Mechanical Polishing 53 ChemetriQ 53 TestStation LX 53 CMOS circuitry 53 ProLINE RoadRunner 53 Star RCXT 53 NXP Nexperia 53 NI DAQmx driver 53 Flip Chip 53 pin TSSOP package 53 BCM# SoC 53 KYEC 53 amorphous alloy transformer 53 PolarPro 53 nanometer lithography 53 Fab #i 53 J BERT 53 Lynx2 53 AlSiC 53 mask reconfigurable 53 MB#R# 53 T-BERD/MTS-# 53 electro mechanical components 53 strain gage 53 electron beam welding 53 #.#um [002] 53 Marvell #DE# 53 Oxide Silicon 53 tapeouts 53 mask aligners 53 impedance matching 53 linear transducers 53 TWINSCAN XT #i 53 VideoCore 53 FastScan 53 X7R 53 MESFET 53 photomask 53 picoArray 53 TWINSCAN XT 53 Solido Variation Designer 53 connectorization 53 ZMD# 53 through silicon vias 53 TrueScale 53 HSIM 53 SCHUNK 53 photoresist coaters cleaners 53 LTPS TFT 53 Coriolis meters 53 iCoupler 53 SiliconSmart 53 kDiagnostics 53 gigabit Gb NAND flash 53 ICOS WI 53 circuit IC 53 ceramic capacitor 53 3D TSV 53 MEMS fabrication 53 CS# [002] 53 MicroFET 53 Package SiP 53 SFP SFP + 53 lithographic processes 53 microvias 53 MPC#E 53 MT#C 53 LQFP# package 53 DIN rail mounted 53 Silicon Via TSV 53 backplane connectors 53 PowerDI TM 53 debug characterization 53 TestPoint 53 SiGe C 53 heat shrinkable tubing 53 flexo plates 53 CMOS oscillators 53 numerical aperture NA 53 manufacturability DFM 53 OptoCooler 53 PSpice 53 linear encoders 53 UltraWave #G 53 GaAs MMIC 53 4 x 4mm 53 wafer bonders 53 pin TQFP package 53 mux demux 53 silicon oxynitride SiON 53 OPTEK 53 DSA# [001] 53 CHIPit 53 Gigabit Ethernet adapters 53 #nm CMOS [002] 53 HardCopy 53 nm NAND flash 53 thinner wafers 53 etch deposition 53 NXT #i 53 Mbit MRAM 53 RFIC design 53 Altera Quartus II 53 Ramco VirtualWorks 53 RF LDMOS 53 Wafer Level 53 RFIC 53 RF ICs 53 AMCC QT# 53 bond aligner 53 Electrovert 53 EVG# 53 Talus RTL 53 jitter measurement 53 PCI cPCI 53 TetraMAX ATPG 53 Bipolar CMOS DMOS BCD 53 pipettors 53 SiTime 53 Nasdaq CSCD 53 CN# chipset 53 QuickCap NX 53 laser micromachining 53 SOI wafer 53 QT# [001] 53 programmable SoC 53 oscilloscopes protocol analyzers 53 #nm photomask 53 silicon foundries 53 Encounter RTL Compiler 53 semiconductor foundry 53 #nm HKMG 53 AXIe 53 Ember ZigBee 53 DDR3 DIMMs 53 EMI shielding 53 etching DRIE 53 nanopositioning 53 Deep Reactive Ion Etch 53 #.#μm CMOS process 53 SPICE simulation 53 opto electrical 53 Z8 Encore 53 SUSS 53 NASDAQ KLAC 53 Silicon CMOS Photonics 53 LDRA Testbed 53 8mm x 8mm 53 crystal oscillator 53 VLSI circuits 53 millimeter silicon wafers 53 Gallium Arsenide GaAs 53 crystal resonator 53 solder reflow 53 nm geometries 53 ARM#T# S processor 53 PXI Express 53 nonvolatile static random 53 WiMAX baseband 53 Fiber Driver 53 ISL#M 53 imprint lithography 53 capacitance values 53 XtremeDSP TM 53 About Xilinx Xilinx 53 TrenchFET 53 Analog ICs 53 Presto Engineering 53 discrete semiconductors 53 insert molding 53 SFP + transceivers 53 CMP slurry 53 ADLINK Technology 53 thermo mechanical 53 RISC DSP 53 Xilinx FPGAs 53 #nm CMOS [001] 53 Advantest T# 53 Octeon 53 integrating NVM 53 projected capacitive touch 53 warpage 53 PaxScan 53 TBrun 53 PowerQUICC III 53 AquiVia 53 EnerChip CC 53 ferrite beads 53 virtual prototyping 53 Gbps transceiver 53 micromirror 53 ZenTime 53 engineered substrates 53 Talus Vortex 53 stencil printing 53 finite element modeling 53 EMI Filters 52 FPGA prototyping 52 Jetrion R 52 workholding 52 Model #A 52 Applied Baccini 52 pin BGA package 52 piezo actuator 52 nonpolar GaN 52 Nasdaq LTXX 52 photomasks 52 exacting tolerances 52 microelectronic components 52 #x# mm [003] 52 SiS# chipset 52 Credence Systems Corp. 52 solder mask 52 MPC# processor 52 sampling oscilloscopes 52 MMA#L 52 #nm wafers 52 CMOS ICs 52 nanometer nm CMOS 52 CRIUS II 52 manufacturability 52 IPFlex 52 RF microwave components 52 TDS# [001] 52 multichip module 52 TestStation 52 BCDMOS 52 #.#V CMOS 52 ER# [002] 52 RFMD GaN 52 Silicon Germanium SiGe 52 board assembly PCBA 52 DAC# 52 inkjet printhead 52 ISE Labs 52 Avalue Technology 52 GxT 52 XDR DRAM 52 SOT# package [001] 52 DFN# 52 subrack 52 furnaceware 52 gasketing 52 CellMath IP 52 SE#L 52 T# SoC 52 MCP#X 52 MirrorBit ORNAND2 52 RealTime Designer 52 DDR3 modules 52 Synopsys DesignWare IP 52 Methodology Kit 52 AFS Nano SPICE simulator 52 ITRS roadmap 52 STK# [001] 52 Impinj AEON 52 plasma etching 52 #.#x#.#mm 52 MT#F# 52 Quartz DRC 52 #nm MLC 52 4Gbps FC 52 Mode Simulation 52 perfluoroelastomer 52 #nm nodes 52 using laminating molding 52 HEMTs 52 squeegee blades 52 solderable 52 workcells 52 Quartz LVS 52 TMS#DM# [002] 52 inkjet printing systems 52 monolithic microwave integrated 52 opto electronic 52 Esatto Technology 52 CY#C#x# 52 parametric measurements 52 AMCC PowerPC 52 nm SOI 52 synthesizable IP 52 Non Volatile Memory NVM 52 HPLC columns 52 Configurable Logic 52 reconfigurability 52 #bit ADCs 52 nucleic acid extraction 52 MSO# [001] 52 Calibre nmDRC 52 x ray optics 52 Wafer Level Cameras 52 HPLC-Chip/MS 52 SLC NAND flash 52 Digitaltest 52 modules actuators 52 SynTest 52 Agilent E#A 52 MXC# 52 VideoBRIDGE series 52 SierraFC M8 4 52 wire EDM 52 digital multimeter 52 Xtensa processors 52 repeatable measurements 52 CdTe Si 52 Memory Controllers 52 MS#A 52 abrasive waterjet 52 Corporation NASDAQ PSEM 52 Aixtron MOCVD 52 Exoscan 52 #nm VCSEL [001] 52 DfM 52 Cascade Microtech NASDAQ CSCD 52 wire bonder 52 transceiver modules 52 resistive element 52 WiMAX SoC 52 Xtensa processor 52 Serdes 52 BiFET 52 Schottky diode 52 orbital welding 52 MPR# [003] 52 Encounter Conformal Constraint Designer 52 toolholders 52 ASL #RF 52 PQFN package 52 4mm x 4mm 52 #x# mm [004] 52 workstation graphics accelerators 52 Siplace 52 UMC #.#um 52 weldments 52 multilayer ceramic capacitors 52 Calibre DFM 52 wirebonding 52 spherical roller bearings 52 singlemode 52 CMOS compatible 52 EUV mask 52 MirrorBit Quad 52 multilayer ceramic 52 Genesys Logic 52 #nm 1Gb 52 #x# mm QFN 52 SiPro 52 silicon PV modules 52 #nm [001] 52 QSOP 52 Infiniium oscilloscopes 52 Backplane 52 wafers 52 AVR microcontrollers 52 LGS #G# 52 RFeICs 52 cellular baseband 52 mask aligner 52 Stratasys FDM 52 voltage MOSFET 52 Stratix GX devices 52 Altera FPGAs 52 optical inspection AOI 52 OLED XL 52 UltraWave 52 underfill 52 Nios II 52 ESD electrostatic discharge 52 digital isolator 52 deep submicron CMOS 52 MB#K# 52 Palomar Microelectronics 52 EXTreme 52 spectroradiometers 52 TCAD Sentaurus 52 digital multimeters DMMs 52 SerDes 52 layer ceramic capacitor 52 TSMC foundry 52 SpectralWave 52 Inc. Nasdaq PHTN 52 Senpai Series 52 backside metallization 52 CSM# 52 MTP NVM 52 tunable optical 52 OM# [002] 52 micro optics 52 serdes 52 tight tolerances 52 overmolding 52 analog IC 52 midspans 52 Tektronix DPO# 52 FPGAView software 52 #GB RDIMM 52 copper metallization 52 nm CMOS 52 electron optics 52 pin LQFP package 52 #mm fabrication 52 daughtercards 52 algorithmic synthesis 52 Wafer Level Camera 52 SOT# [002] 52 Kozio 52 Agilent #B [001] 52 extruded sheet 52 8bit MCU 52 Nasdaq NVLS 52 silicon photonic 52 rheometer 52 waterjet cutting 52 AKU# 52 DRAM modules 52 Optocoupler 52 Mentor Calibre 52 SUSS MicroTec FWB SMH 52 MEMS resonator 52 FDM #mc 52 MP#A 52 Optical Surfaces 52 microcontrollers capacitive touch 52 Nanometrics automated 52 Nasdaq KLAC 52 axis CNC 52 PICO Extreme 52 ENIG 52 Spirent TestCenter 52 extruded profiles 52 SwitchCore 52 QFP package 52 solder alloy 52 toolholder 52 Tetra Reticle Clean 52 AirMaestro 52 TQFP 52 pipettor 52 HOTLink II 52 ferrite core 52 Abrisa Technologies 52 multicore architecture 52 athermal 52 SPICE accurate 52 holistic lithography 52 optocoupler 52 5V CMOS 52 Ball Grid Array 52 wave soldering 52 Xpedion 52 ANSYS FLUENT 52 #nm NAND flash 52 deburring 52 L#A [001] 52 Atheros AR#X 52 HV# [001] 52 Agilent B#A 52 displays FPD 52 Cascade Microtech 52 CNC milling machines 52 standalone metrology 52 hydraulic pneumatic 52 OptoCooler HV# 52 ASML TWINSCAN 52 Elpida #nm 52 forgings castings 52 DPOJET 52 RTL Compiler 52 Flow cytometry 52 wire bondable 52 ArF immersion 52 GaN HEMT 52 FTB #B 52 TRF# [001] 52 nanometer nm node