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(Click for frequent words.) 71 microns 71 μm 70 #.#μm [002] 69 nanometer 68 micrometer 67 nanometers 67 #.#μm [001] 66 nm 65 #μm [001] 65 mm ² 64 nanometers nm 64 #.# micron CMOS 64 #μm [002] 63 #.#um [002] 63 #.# micron node 63 #nm [001] 63 #.#um [001] 62 #um [002] 61 #nm [002] 61 1μm 61 micrometre 61 nanometer nm 61 micron thick 60 nm CMOS 60 5μm 60 #.#mm [002] 59 .# micron 59 5nm 59 angstrom 59 CMOS 59 millimeter mm 59 #x# mm [004] 59 micron wafers 59 #.#μ 59 linewidths 59 micron pixel 59 sub micron 59 wafer 59 x #.#mm [005] 58 micrometres 58 #nm CMOS [001] 58 BiCMOS 58 mu m 58 #.#nm [002] 57 nanometer CMOS 57 #.#μm CMOS 57 hafnium oxide 57 CMOS logic 57 solder bumps 57 defect densities 57 nm CMOS process 56 nanometric 56 mm2 56 mm wafers 56 #nm silicon 56 photolithographic 56 WLCSP 56 nanometer node 56 copper interconnects 56 #nm SOI 56 CMOS transistors 56 #.#um CMOS 56 SiO 2 56 #mm ² [001] 56 x #.#mm [003] 56 #nm #nm [002] 56 microns thick 56 #.#x#.#mm 56 nanometer silicon 56 angstroms 56 millimeter 56 pin BGA package 56 high voltage BCDMOS 56 μm thick 56 capacitances 56 2μm 56 mm 56 wafer thickness 56 #.#u 56 silicon 55 wafers 55 submicron 55 imprint lithography 55 #MSPS 55 sq. mm 55 oxide thickness 55 μm diameter 55 CMOS wafer 55 #nm DRAM 55 6mm 55 nm nodes 55 Nanometer 55 numerical aperture NA 55 #nm lithography [002] 55 m 55 capacitance values 55 #nm node [002] 55 FinFET 55 nm wavelengths 55 um CMOS 55 mm BGA 55 5V CMOS 55 millimeter silicon wafers 55 SiO2 55 photodetector 55 phototransistors 54 #nm node [001] 54 silicon germanium SiGe 54 nanometer lithography 54 #mm# [002] 54 MOS transistors 54 BGA packages 54 QFN packages 54 DongbuAnam 54 nm lithography 54 pHEMT 54 x 9mm 54 planarization 54 #.#μm CMOS process 54 Mbit 54 DFN packages 54 #nm #nm [005] 54 micrometers 54 #mm wafers 54 k dielectric 54 InGaN 54 2nm 54 1nm 54 wafer dicing 54 DDR2 DRAM 54 gigabit Gb NAND flash 54 Gb NAND 54 CMOS wafers 54 SOI wafers 54 #mm wafer 54 mW MHz 54 Mbit MRAM 54 #mm ² [002] 54 micron thickness 54 ZnSe 54 copper metallization 54 SOI CMOS 54 micron diameter 54 wirebond 54 numerical aperture 54 reactive ion 54 Mbit SRAMs 54 #μ 54 #nm nodes 54 AlN 54 CMOS IC 54 silicon substrates 54 BCDMOS 53 pin TSSOP 53 photodetectors 53 1mm 53 #x#mm [002] 53 wafer foundries 53 FinFETs 53 Ball Grid Array 53 micromachined 53 dual damascene 53 +# micron 53 wph 53 #.#mm [007] 53 #mm# [003] 53 optical waveguides 53 micron pixels 53 silicon Si 53 gate dielectrics 53 photolithography 53 sub Angstrom 53 pin QFN package 53 W mK 53 ZrO 2 53 solder bump 53 CdSe 53 nanometers nanometer 53 bipolar transistors 53 PBGA package 53 mm wafer 53 SO8 53 2mm 53 silicon germanium SiGe BiCMOS 53 #nm CMOS [002] 53 #.#mm x [003] 53 BGA packaging 53 SAR ADC 53 inductance 53 inch wafers 53 dielectric constant 53 multilayers 53 BGA package 53 #x#mm package 53 CMOS fabrication 53 HEMT 53 ZnS 53 #um [001] 53 UMC #nm 53 low k dielectric 53 wafer bumping 53 Si substrate 53 low k dielectrics 53 #.#mm x #.#mm [002] 53 sintered 53 digital converter ADC 53 x 3mm 53 5mm x 5mm 53 Angstroms 53 subwavelength 53 dielectrics 53 mm diameter 53 leadless 52 Elpida #nm 52 #mm x #mm [001] 52 MESFET 52 CMOS compatible 52 epitaxy 52 microtubes 52 bandgap 52 fused silica 52 immersion lithography 52 5mm x 52 leadless package 52 #nm transistors 52 #nm RF CMOS 52 substrate 52 micrometers thick 52 silicon substrate 52 micron CMOS 52 High Voltage CMOS 52 LiNbO3 52 micromachining 52 aluminum nitride 52 4 x 4mm 52 Schottky 52 solder bumping 52 high-k/metal gate 52 electron mobility 52 pin SOT 52 pin QFN 52 laser annealing 52 TSMC #nm process 52 ADA# 52 EUV masks 52 wirebonding 52 Cpk 52 transistor 52 #.#in [004] 52 #/#nm 52 #.#mm x #.#mm [003] 52 #μm thick [002] 52 micro SMD package 52 #Mbit [002] 52 nanometer scale 52 crossbred fleece 52 capacitance 52 MSOP packages 52 insulator wafers 52 GaAs substrates 52 photoresists 52 manufactures integrated circuits 52 UMC #.#um 52 hydride vapor phase 52 logic CMOS 52 #Msps [001] 52 QFN# package 52 HfSiON 52 Flip Chip 52 Si substrates 52 nano imprint 52 nm geometries 52 TiN 52 millimeter diameter 52 InSb 52 #.#mm# [002] 52 epitaxy HVPE 52 #.#mm thick [002] 52 SiC wafers 52 lp mm 52 InGaP HBT 52 DFB lasers 52 AlGaAs 52 DFN package 51 SiON 51 gigabit Gb 51 voltage CMOS 51 cm -2 51 6T SRAM 51 pin TQFP package 51 SiC substrates 51 g cm 51 Fine Crossbred Indicator 51 ARM#EJ processor 51 QFN packaging 51 SOI substrates 51 glass substrates 51 InGaAs 51 meV 51 nanometer transistors 51 indium gallium arsenide InGaAs 51 #nm FPGA 51 3nm 51 SerDes 51 TSMC #nm [001] 51 photonic bandgap 51 computational lithography 51 indium phosphide 51 MEMS resonators 51 threshold voltages 51 #.#mm x #.#mm x [002] 51 ohm cm 51 Silicon Oxide Nitride 51 picosecond 51 Epitaxial 51 #.#mm# [001] 51 InAs 51 silicon CMOS 51 nonpolar GaN 51 #Msps [002] 51 epitaxial layers 51 laterally diffused metal 51 TDFN packages 51 wire bondable 51 epiwafers 51 nanometers billionths 51 #ksps 51 3Xnm 51 intrinsic jitter 51 micrometer sized 51 geometries shrink 51 underfill 51 brightfield 51 QMEMS 51 dielectric materials 51 silicide 51 #mm# [001] 51 micrometer scale 51 Cu interconnects 51 flexographic plates 51 nitride semiconductor 51 nm node 51 Gbits s 51 6mm x 51 mm × 51 nm immersion 51 particle sizes 51 singlemode 51 VCSELs 51 mW/cm2 51 PHEMT 51 TSMC #.#um 51 SOT# package [001] 51 leadframe 51 Gbit 51 ArF immersion lithography 51 silicon oxynitride 51 dielectric layers 51 glass substrate 51 silica spheres 51 GaN layers 51 pMOS 51 nm SOI 51 nanometer NAND flash 51 epitaxial 51 2Xnm 51 W/cm2 51 SOT# [001] 51 nanomesh 51 SWIR cameras 51 cm ² 51 GaAs substrate 51 WL CSP 51 SOI wafer 51 microstrip 51 pin DIP 51 JFET 51 #x# mm [003] 51 SiGe BiCMOS 51 CdTe Si 51 2mm x 2mm 51 nm wavelength 51 amorphous silicon 50 GaAs MESFET 50 e beam lithography 50 pin SOIC 50 QFN package 50 silicon wafer 50 2Gbit 50 zirconium oxide 50 #nm 8GB 50 #nm SoC 50 Oxide Silicon 50 CMOS processes 50 7mm x 50 CVD diamond 50 pin BGA 50 DDR3 modules 50 SWCNT 50 nsec 50 SiGe bipolar 50 lead LFCSP 50 monochromator 50 #nm immersion lithography 50 micrometre scale 50 microcavity 50 optocoupler 50 polystyrene spheres 50 NiSi 50 SiGe C 50 OCXO 50 geometries 50 pcb 50 pin LQFP 50 TCXO 50 arcsecond 50 Dektak 50 eutectic 50 7mm x 7mm 50 sapphire substrate 50 GaN wafers 50 SIMOX 50 AlGaN 50 pin LQFP package 50 in. dia 50 kS s 50 dielectric etch 50 digital converters ADCs 50 TiO 2 50 megapixel CMOS sensors 50 Arria GX FPGAs 50 SiGe 50 photodiode 50 nanoliter 50 InP 50 #nm/#nm 50 crystalline silicon c 50 x 6mm 50 LSA#A 50 3mm 50 insulator SOI technology 50 epitaxial deposition 50 microbolometer 50 8 pin SOIC 50 4mm x 4mm 50 x 4mm 50 R# #/kg [001] 50 triplexer 50 pin SSOP package 50 UltraCMOS 50 #Mb DDR2 50 QFPs 50 silicon micromachining 50 micrometer thick 50 microvias 50 #.#uF 50 optically coupled 50 C0G 50 through silicon vias 50 ENOB 50 mm x 50 polycrystalline 50 mrad 50 6nm 50 SOT# [002] 50 silicon nitride 50 #nm fabrication 50 indium phosphide InP 50 CMOS circuits 50 VCSEL 50 #.#mm x #.#mm [004] 50 ATtiny# 50 MLCCs 50 3mm x 3mm x 50 KHz 50 TQFP packages 50 monolithic microwave integrated 50 HEMTs 50 pin SOIC packages 50 Gallium Arsenide 50 VCXO 50 voltage MOSFET 50 semiconducting material 50 photon detection 50 Gb DDR3 50 #GS s 50 absorbance 50 ADC#D# 50 #GHz [001] 50 LDMOS 50 AlGaN GaN 50 #nm wavelength [001] 50 #Mbit DDR2 50 laser micromachining 50 microchannel plate 50 nm immersion lithography 50 SOI MEMS 50 oxide thickness EOT 50 multichip 50 Bipolar CMOS DMOS 50 crystalline Si 50 fiber optic transceivers 50 surface roughness 50 pin TQFP packages 50 silicon photonic 50 QFN 50 Imprio 49 Bragg grating 49 substrates 49 indium gallium phosphide InGaP 49 x 5mm 49 serdes 49 microlitre 49 LQFP# package 49 nanoimprint 49 CMOS oscillators 49 linewidth 49 8mm x 8mm 49 ZL# [003] 49 ° sec 49 microfarads 49 X7R 49 carbon nanotube CNT 49 #nm NAND flash 49 3mm x 3mm 49 strontium titanate 49 photonic crystal 49 CMOS silicon 49 collimators 49 sapphire wafer 49 #.#um CMOS process 49 mechanical polishing CMP 49 transimpedance amplifier 49 oxide semiconductor 49 pin PBGA package 49 RDS ON 49 LQFP 49 TSVs 49 1mm x 1mm 49 silicon germanium 49 PowerDI TM 49 PIN photodiode 49 SiC 49 nanowatts 49 DDR3 DIMMs 49 EUV mask 49 TSSOP 49 lithographic 49 TDFN package 49 inductors 49 vias 49 mV 49 mm diameters 49 advanced leadframe 49 measuring #.#mm x [001] 49 5mm x 6mm 49 passband 49 SMIC #.#um 49 MSPS ADC 49 ATR# [002] 49 GaAs InP 49 Bipolar CMOS DMOS BCD 49 XRT#L# 49 pre preg 49 mm QFN package 49 rigid substrates 49 BiCMOS processes 49 #.#pF 49 pin 4mm x 49 SOIC package 49 nickel silicide 49 Stratix II 49 Megabit Mb 49 plasma etching 49 On Insulator SOI 49 ArF 49 Flexfet 49 overlay metrology 49 nitride 49 3mm DFN package 49 FBGA package 49 microbolometers 49 embedded SRAM 49 Photolithography 49 transistor arrays 49 nm SRAM 49 gigabit DDR3 SDRAM 49 planar 49 tin Sn 49 dielectric 49 thermally conductive 49 micromirror 49 BEOL 49 varactors 49 Schottky barrier 49 pulsed laser deposition 49 rms jitter 49 OP# [003] 49 gate electrode 49 8mm diameter 49 reticles 49 #nm FPGAs 49 nanometer nm CMOS 49 SOI substrate 49 GaAs pHEMT 49 EP#S# 49 emitting lasers 49 FWHM 49 THz radiation 49 chipscale 49 RF transistors 49 micro machining 49 iCoupler 49 t/m3 49 μS cm 49 AlInGaP 49 microvia 49 leadframes 49 heterostructure 49 Silicon Germanium 49 × #mm [002] 49 silicon waveguide 49 Vdd 49 mount SMT 49 D2PAK 49 ITRS roadmap 49 nanopowders 49 micrometres thick 49 monolayer 49 Silicon Nitride 49 #Gbit [001] 49 FDSOI 49 kerf 49 Gbps transceiver 49 pin SSOP 49 photoresist 49 silicon dioxide 49 silicon nanowire 49 QFN# packages 49 nanoliters 49 epitaxial layer 49 #x#mm [004] 49 8Gbit 49 undoped 49 singulated 49 PIC#F# [002] 49 GaP 49 #V MOSFETs [002] 49 embedded SerDes 49 Kbit 49 ownership CoO 49 microliters 49 #.#mm [001] 49 smaller geometries 49 k gate dielectrics 49 #.#mm [005] 49 4mm x 49 wafer thinning 49 Structured ASIC 49 SST SuperFlash technology 49 bandpass 49 Schottky rectifiers 49 k gate dielectric 49 semiconductor 49 #nm wavelengths 49 #bit ADC 49 millimeters mm 49 spiral inductors 49 .3 microns 49 ferrite 49 wafer fabrication 49 EMIF# 49 nanoimprinting 49 microvolts 49 emission wavelength 49 epitaxial silicon 49 surface mountable 49 OPA# [002] 49 Gbps transceivers 49 #Mx# [002] 49 micron particle 49 6GHz 49 dB insertion loss 49 cuvettes 49 millimeter wafer 49 wafer probing 49 GaN HEMT 49 antifuse 49 GHz 49 #nm VCSEL [001] 49 deep ultraviolet DUV 49 pin SOIC package 49 waveguides 49 stripline 49 MCP# AFE 49 Soitec produces 49 #MS s [002] 49 high-k/metal gate HKMG 49 magnetic encoder 49 calcium fluoride 49 laser interferometer 49 #.#mm x [001] 49 optical lithography 49 megabit Mb 49 gigabit NAND flash 49 wirewound 49 EUV lithography 48 nanoindentation 48 2Gb DDR3 48 LTPS LCD 48 inch sapphire wafers 48 vertical cavity 48 #nm laser [001] 48 VIISta 48 selective emitter 48 #mm silicon wafer 48 physical layer PHY 48 SO8 package 48 #nm lithography [001] 48 embedded nonvolatile memory 48 nm VCSEL 48 diameter wafers 48 Gbit NAND flash 48 6mm x 6mm 48 CMOS foundry 48 microfabricated 48 ASML TWINSCAN 48 HfO2 48 superlattice 48 CS# [002] 48 nanofilm 48 SWNT 48 microfabrication 48 #.#V [001] 48 nH 48 amorphous silicon Si 48 #-#,# mm 48 reflow soldering processes 48 fluorescence detector 48 8bit MCU 48 MOS transistor 48 SOIC 8 48 nanometer nm node 48 indium gallium nitride 48 1Mbit 48 #mm x #mm [007] 48 analyte 48 chip resistors 48 indium arsenide 48 frequency comb 48 Gigahertz GHz 48 HRTEM 48 lithography 48 semiconductor wafers 48 #nm immersion 48 PIN diodes 48 Gallium Nitride 48 μA 48 ion beam 48 ± #.#mm [001] 48 pin QFN packages 48 epitaxial wafers 48 6 pin SOT 48 isotropic 48 TSMC Reference Flow 48 -# mesh 48 tapeouts 48 Al#O# 48 chip inductors 48 XR#M# 48 ADS# [002] 48 polydimethylsiloxane PDMS 48 shaft diameters 48 conductivities 48 3 x 3mm 48 nm excitation 48 transistor HEMT 48 inch wafer fabs 48 refractive index 48 SOIC packages 48 4mm thick 48 Vsby 1 48 RFCMOS 48 ECPR 48 #mm #mm [003] 48 TestKompress 48 fully synthesizable 48 darkfield 48 mesoporous 48 μm particle 48 magnetic separator 48 Schottky diode 48 fxP 48 1mm thick 48 zirconium oxide ZrO2 48 VECTOR Express 48 multimode optical fiber 48 GSa s 48 gallium nitride GaN 48 ferroelectric RAM 48 nm MirrorBit 48 mm thick 48 mm LFCSP 48 lanthanum aluminate 48 FEOL 48 TSSOP package 48 kHz 48 anneal 48 SiliconSmart ACE 48 CaF2 48 Stratix IV FPGA 48 Msps 48 Schottky diodes 48 monolithically integrated 48 pellicle 48 EVG# 48 μL 48 centrifugation 48 nanopatterned 48 SiP 48 Gigahertz 48 gigabit GDDR5 48 #.#μF 48 TrenchFET 48 coplanarity 48 ESD protection 48 MI #XM 48 epiwafer 48 microampere 48 SOI silicon 48 serializer deserializer 48 7 x 7mm 48 HardCopy 48 quartz oscillators 48 Sigma fxP 48 waveguide 48 DMIPS MHz 48 epi wafers 48 Laser diodes 48 #nm laser [002] 48 instrumentation amplifier 48 sub picosecond 48 monodisperse 48 borosilicate glass 48 ferrite core 48 inch wafer fabrication 48 mK 48 Nd YAG 48 Virtex 5 48 #nm SRAM 48 XFP module 48 Flash microcontrollers 48 picoliter 48 GaN HEMTs 48 Silego 48 film transistors TFTs 48 SMT LEDs 48 HKMG 48 heterostructures 48 optically transparent 48 conductive epoxy 48 Stratix II GX 48 vapor deposition 48 TFTs 48 kbit 48 silicon etch 48 1Gb DDR3 48 crystal resonator 48 SDS PAGE 48 XA Spartan 3A 48 JFETs 48 #.#kV [001] 48 Nova NanoSEM 48 Gigabit DDR2 SDRAM 48 femtogram 48 microwatt 48 Fabry Perot 48 flexible substrates 48 CY# [003] 48 nanotubes nanowires 48 dopant 48 XtremeDSP TM 48 scintillator 48 aspherical lens 48 mux demux 48 MAX# integrates 48 tantalum capacitors 48 nanometer NAND 48 insulator substrate 48 5mm QFN package 48 μm wavelength 48 nanocrystalline 48 micrometre sized 48 boron nitride 48 defectivity 48 CMP consumables 48 gallium nitride 48 agarose 48 silicon wafers 48 #mm [001] 48 picoseconds 48 parasitic inductance 48 Ascentis Express 48 5mm 48 extrudate 48 Victrex PEEK 48 Pb 48 SiT# 48 meter multispectral 48 μW 48 uL 48 perovskite 48 Gbps 48 HardCopy II 48 gigabit DDR3 48 piezo ceramic 48 #/#-nanometer 48 #GBASE CX4 48 optical waveguide 48 foot lamberts 48 #nm [003] 48 pin 5mm x 48 sapphire SOS 48 oxide layer 48 UV absorbance 48 EO polymer 48 doped silicon 48 line BEOL 48 #.#mm diameter [002] 48 IRF# 48 metallization 48 PECVD 48 GDDR4 48 diode arrays 48 IR#S 48 PIN diode 48 optoelectronic 48 dimensional tolerances 48 embedded EEPROM 48 mosfet 47 etching DRIE 47 #.#mm thickness [001] 47 Carbon nanotube 47 picoliter droplets 47 density interconnect HDI 47 bipolar CMOS DMOS 47 AlSiC 47 parasitic capacitance 47 LTPS TFT 47 dielectric constants 47 reticle inspection 47 wirewound resistors 47 wafer diameters 47 projected capacitive touch 47 electron optics 47 ACPL #J 47 lithographic processes 47 milliohm 47 UHPLC 47 XDR DRAM 47 8 pin MSOP 47 #nm #nm [001] 47 deep submicron CMOS 47 DS DBR 47 L#A [001] 47 aspheric 47 #/#-inch [002] 47 RF amplifier 47 capillary tube 47 hardened steels 47 femtosecond 47 electroformed 47 ceramic capacitor 47 transparent conductive 47 silicon oxynitride SiON 47 MAX# MAX# [001] 47 PQFN package 47 microfocus 47 gallium phosphide 47 #nm NAND Flash 47 subnanometer 47 ZIF 47 deep submicron 47 picosecond lasers 47 nm FPGA 47 mask ROM 47 ohmic contacts 47 AFMs 47 TWINSCAN XT 47 MEMS gyros 47 numerical apertures 47 #MS s [001] 47 #LP [002] 47 #.#mm x #.#mm [001] 47 Kbits 47 photoemission 47 epitaxial wafer 47 package SiP 47 PEDOT PSS