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(Click for frequent words.) 71 low k dielectrics 68 gate dielectrics 67 coextruded 67 dielectrics 67 dielectric 66 k dielectric 66 SOI silicon 66 transparent conductive 66 pMOS 65 nickel silicide 65 hafnium oxide 65 copper interconnects 64 gate dielectric 64 planarization 64 dielectric constant 64 electrically insulating 64 silicon nitride 64 K dielectrics 64 polyimide 64 silicon substrates 64 nanocrystalline 63 k gate dielectric 63 SOI CMOS 63 nitride 63 silicide 63 gate electrode 63 BEOL 62 epitaxial 62 eutectic 62 sputter deposition 62 dielectric layers 62 SiO 2 62 #nm CMOS [002] 62 mechanical polishing CMP 62 insulator wafers 62 silicon 62 underfill 62 HfSiON 62 semiconductive 62 processability 62 MOS transistors 62 photoresists 62 solder bumping 61 AlN 61 photoresist 61 CIGS copper indium 61 copper indium diselenide 61 transparent electrode 61 copper metallization 61 nanoporous 61 metallization 61 titanium nitride 61 dielectric materials 61 optically transparent 61 wafer thickness 61 #.# micron node 61 metallised 61 manganite 61 thermoplastic polyurethane TPU 61 CMOS transistors 61 epitaxial layers 61 NiSi 60 silicon dioxide 60 vapor deposition 60 silicon germanium 60 insulator substrate 60 passivation layer 60 AlGaN 60 k dielectrics 60 encapsulant 60 #nm silicon 60 backside metallization 60 multilayer 60 Polyimide 60 Si substrate 60 polydimethylsiloxane PDMS 60 polydimethylsiloxane 60 Si substrates 60 metallisation 60 TiN 60 amorphous silicon Si 60 FinFET 60 #μm thick [002] 60 micrometer thick 60 polymeric 60 electrolytic capacitors 60 indium oxide 60 photonic bandgap 60 through silicon vias 60 laminations 60 coextrusion 60 optical waveguides 60 FinFETs 60 passivation layers 60 wafer dicing 60 crystallinity 60 transparent conductive oxide 60 machinability 60 On Insulator SOI 60 thermo mechanical 60 insulator SOI technology 59 fluoropolymer 59 silicon oxide 59 thermoplastic polyester 59 biaxially oriented 59 silicon germanium SiGe 59 polymer composite 59 bicomponent 59 LiNbO3 59 substrate 59 k gate dielectrics 59 CIGS cells 59 solder bumps 59 ZnS 59 oxide semiconductor 59 microcrystalline 59 photolithographic 59 indium phosphide 59 silicon oxynitride 59 aluminum nitride AlN 59 eG ViaCoat 59 indium tin oxide ITO 59 Strained silicon 59 MEMS resonators 59 high-k/metal gate 59 microporous 59 silicon Si 59 film transistors TFTs 59 siloxane 59 titanium carbide 59 sol gel 59 downgauging 59 3Xnm 59 atomically thin 59 ferrite 59 APTIV film 59 thermal conductivity 58 insulator SOI 58 electrodeposition 58 resistive element 58 Insulator SOI 58 defect densities 58 hardcoat 58 thermosetting 58 silicon substrate 58 gasketing 58 SOI substrates 58 solder bump 58 thermoset composite 58 rectifier diode 58 epitaxy 58 eutectic solder 58 CMP slurry 58 metallizing 58 tin oxide 58 nanoparticle inks 58 flexible substrates 58 oxynitride 58 copper indium gallium diselenide 58 pulsed laser deposition 58 Powerful debug 58 encapsulant sheets 58 lithographic processes 58 nMOS 58 interfacial layer 58 nanometer silicon 58 UVTP 58 di selenide CIGS 58 ionomer 58 wafer thinning 58 Silicon Nitride 58 Hafnium 58 Epitaxial 58 meltblown 58 silicate glass 58 weldability 58 PZT 58 #.# micron CMOS 58 barium titanate 58 dual damascene 57 thermoplastic elastomer 57 dielectric layer 57 thermoformable 57 Micromorph 57 self assembled monolayers 57 polyvinylidene fluoride PVDF 57 aluminum nitride 57 polymer composites 57 SiON 57 magnetron sputtering 57 engineered substrates 57 heterostructure 57 multilayers 57 ZnO nanowires 57 PEDOT PSS 57 insert molding 57 gallium selenide 57 SiO2 57 leadframes 57 tribological 57 vinyl esters 57 Gallium arsenide 57 dielectric constants 57 FEOL 57 substrates 57 laminate substrate 57 AlGaAs 57 ZnSe 57 gallium indium 57 SOI wafers 57 indium gallium arsenide 57 III nitride 57 Kapton 57 polyphenylsulfone 57 bismuth telluride 57 EVOH 57 #nm node [001] 57 titania 57 Gallium nitride GaN 57 compressive stress 57 sapphire substrate 57 calcium fluoride 57 HfO2 57 interlayer 57 multilayer ceramic capacitors MLCC 57 polytetrafluoroethylene PTFE 57 defectivity 57 nm CMOS process 57 indium gallium 56 Transparent Conductive Oxide TCO 56 polyethylene PEN 56 conductive polymer 56 Aclar 56 #nm/#nm 56 heat sealable 56 μm thick 56 polyethylene fiber 56 cored wire 56 atomically smooth 56 silicon CMOS 56 thermoplastic polymer 56 .# micron 56 metalized 56 auxetic 56 intergranular 56 oxide layer 56 furnaceware 56 wirebond 56 thermally conductive 56 pentacene 56 LSA#A 56 nano crystalline 56 dimensionally stable 56 antimonide 56 nanofilm 56 CIGS solar cell 56 dye sensitized solar 56 thermo compression 56 nanometric 56 cermet 56 sheet extrusion 56 cadmium selenide 56 EMI shielding 56 laser annealing 56 metallized 56 fused silica 56 AlN layer 56 colloidal silica 56 indium phosphide InP 56 plasma etching 56 Cu interconnects 56 dielectric etch 56 selenide 56 electron mobility 56 advanced leadframe 56 monolithically integrated 56 Photolithography 56 PEEK OPTIMA 56 nano patterning 56 sintered 56 copper indium gallium 56 leadframe 56 CdSe 56 AlGaN GaN 56 Valox 56 silicon oxynitride SiON 56 conductive epoxy 56 polycrystalline 56 UNCD 56 coercivity 56 CIS CIGS 56 #.#um [001] 56 Enable mPE 56 flexible monolithically integrated 56 battery separator 56 integrated passives 56 passivating 56 biaxially oriented polypropylene 56 ductility 56 polyacrylonitrile 56 coated polyester 56 chalcogenide 56 epitaxial layer 56 oxide 56 reinforced composites 56 gallium arsenide indium phosphide 56 Perkinamine 56 elastic modulus 56 wirebonding 55 reflowed 55 #nm immersion lithography 55 Novellus SABRE 55 multilayer ceramic 55 polymer substrates 55 imprint lithography 55 CMOS fabrication 55 TSMC #.#um 55 temperature superconducting 55 nanocrystal 55 superabrasives 55 nm DRAM 55 epiwafers 55 ZnO 55 Indium phosphide 55 MLCC capacitors 55 extrusion coating 55 lattice mismatch 55 clad laminates 55 ethylene vinyl acetate 55 electro optic polymer 55 piezo ceramic 55 weldable 55 BOPET 55 zirconium oxide 55 Silicon dioxide 55 ceramic substrate 55 thickness uniformity 55 thermoset rubber 55 silicone sealants 55 Amorphous silicon 55 CMOS silicon 55 superhard 55 metal matrix composites 55 UV stabilized 55 thermo plastic 55 #nm SOI 55 Nitride 55 PTFE polytetrafluoroethylene 55 amorphous silicon thin 55 LPCVD 55 polycrystalline diamond 55 submicron 55 copper indium gallium selenide 55 sulfonated 55 TSVs 55 ferrites 55 germanium 55 #.#μm [002] 55 ion milling 55 Fiberglass Reinforced 55 FeRAM 55 conductive coating 55 superlattice 55 millisecond anneal 55 ultrathin layer 55 nanoimprint 55 polybutylene terephthalate PBT 55 Schottky 55 polyamides 55 nano imprint lithography 55 metalised 55 parasitic capacitance 55 carbon nanotube CNT 55 biaxial 55 epitaxial silicon 55 polybutylene terephthalate 55 laterally diffused metal 55 conductive inks 55 pre preg 55 InGaP 55 polymer matrix 55 multilayer ceramic capacitors 55 ENIG 55 polyvinyl alcohol 55 styrene butadiene 55 linewidths 55 CIGS photovoltaic 55 ownership CoO 55 ceramic powders 55 #nm [001] 55 conductive adhesives 55 optical coatings 55 heat shrinkable 55 nm node 55 density interconnect HDI 55 polyvinyl butyral 55 gallium indium arsenide 55 PLLA 55 overmolding 55 photolithography 55 Cadmium Telluride CdTe 55 nano structured 55 Complementary Metal Oxide Semiconductor 55 deep sub micron 55 Silicon Germanium 55 #.#μm CMOS process 55 transparent conductive coatings 55 UHMW 54 tensile stress 54 Titanium Nitride 54 Semiconducting 54 Indium Phosphide 54 Bragg grating 54 Polycrystalline 54 prepregs 54 SOI Silicon 54 oxide thickness 54 Amorphous 54 hafnium 54 stereolithography 54 thinner wafers 54 #nm #nm [005] 54 Vor ink 54 CMOS wafer 54 microstructured 54 thermoplastic elastomer TPE 54 nanocomposite 54 cadmium telluride thin 54 pHEMT 54 5V CMOS 54 1μm 54 MgO 54 permittivity 54 ferroelectric 54 nm SOI 54 SOI wafer 54 MESFET 54 block copolymer 54 hydride vapor phase 54 expanded polytetrafluoroethylene ePTFE 54 SOI substrate 54 nitrided 54 encapsulants 54 thermoplastic composite 54 InGaN 54 ferrite materials 54 ferrite core 54 quantum cascade 54 modulus 54 chip resistors 54 Aluminum Nitride 54 thermosets 54 thermal impedance 54 nanostructured 54 electroless nickel 54 Copper Indium Gallium 54 Ti TiN 54 weatherable 54 acrylic adhesives 54 Photoresist 54 transparent electrodes 54 oxide semiconductors 54 Physical Vapor Deposition PVD 54 nanocomposite material 54 adhesive bonding 54 MOS transistor 54 liquid crystal polymers 54 flexural modulus 54 self assembled monolayer 54 EUV mask 54 Indium Tin Oxide ITO 54 polycarbonate resin 54 cemented carbide 54 indium gallium phosphide 54 InAs 54 #nm #nm #nm 54 electroless 54 PHEMT 54 #.#μ 54 pellicle 54 YBCO 54 threshold voltages 54 Ultem 54 photopolymers 54 polyvinyl butyral PVB 54 aluminum electrolytic 54 microlithography 54 planarity 54 GaP 54 metal gate HKMG 54 electro deposition 54 metallization pastes 54 SWCNT 54 organic TFTs 54 flex circuits 54 Solamet ® 54 interfacial 54 adhesive sealant 54 anneal 54 photoresist stripping 54 nanoclay 54 PWBs 54 shrinkable 54 Carbon nanotube 54 multifilament 54 wirewound 54 glass frit 54 electroless copper 54 polyurethane resins 54 Flip Chip 54 compressive stresses 54 ReRAM 54 e beam lithography 54 BOPP films 54 leaded solder 54 electrically conductive 54 thermoplastic rubber 54 transistor arrays 54 gate transistors 54 layer deposition ALD 54 polymer 54 2Xnm 54 MLCCs 54 chalcogenide glass 54 nanolayer 54 austenitic stainless steel 54 CIGS Copper Indium 54 piezoelectric ceramic 54 nano composites 54 embedded capacitor 54 bioresorbable 54 DFEB 54 reactive ion 54 lidding 54 ceramic composites 54 manufactures integrated circuits 54 nanomesh 54 martensite 54 ULK 54 #nm nodes 54 #nm RF CMOS 54 #nm DRAM 54 nanometer 54 #.#μm CMOS 54 nitride semiconductor 54 lithographically patterned 53 stencil printing 53 formability 53 polymer substrate 53 reflow compatible 53 Grätzel cells 53 nanofabricated 53 fluorosilicone 53 nitrides 53 Silicon carbide 53 InGaAs 53 Silicon wafers 53 immersion lithography 53 polymethyl methacrylate PMMA 53 germanium substrates 53 annealing 53 polishing pads 53 Langmuir Blodgett 53 BCDMOS 53 HEMTs 53 anodic 53 GaAs MESFET 53 SiGe bipolar 53 #nm CMOS [001] 53 metallic inks 53 VECTOR Express 53 Si Ge 53 nano coating 53 macroporous 53 #nm lithography [002] 53 heterojunction 53 chemically inert 53 damascene 53 injection molding extrusion 53 HDP CVD 53 tantalum nitride 53 annealed 53 line BEOL 53 nanocrystalline diamond 53 Gallium Arsenide GaAs 53 inherently flame retardant 53 stripline 53 varactors 53 ceramic dielectric 53 HKMG technology 53 polymer nanocomposite 53 carbon nanotubes CNT 53 thermoplastic materials 53 gallium nitride GaN 53 nanostructured surfaces 53 InSb 53 conductive adhesive 53 OCD metrology 53 polymer formulations 53 nm 53 liquid crystal polymer 53 gallium nitride 53 polymer matrices 53 phthalocyanine 53 metallic nanostructures 53 matrix composites 53 circuit MMIC 53 micromachining 53 intermetallic 53 semiconducting 53 transparent conductive oxides 53 outcoupling 53 tantalum capacitors 53 indium tin oxide 53 silica spheres 53 PVDF 53 poly Si 53 delamination 53 martensitic 53 resists abrasion 53 metallic alloys 53 porous silicon 53 PMOS transistors 53 nanometer node 53 CIGSe 53 LDMOS RF power 53 intermetallic compounds 53 crosslinking 53 HEMT 53 ArF immersion lithography 53 Cycoloy 53 epitaxial graphene 53 #μm [001] 53 ECPR 53 polylactide 53 transistor HEMT 53 injection moldable 53 transistor leakage 53 carbides 53 metalizing 53 microcavity 53 ethylene vinyl acetate EVA 53 Physical Vapor Deposition 53 antireflection 53 rigid foams 53 composite laminate 53 metal oxide 53 borosilicate 53 photopolymer 53 Alchimer 53 UHMW PE 53 copper damascene 53 microstructures 53 microcrystalline silicon 53 lanthanum aluminate 53 polymer coatings 53 selective emitter 53 rigid flex 53 alternating layers 53 conductive coatings 53 nanoimprint lithography NIL 53 Formex GK 53 Raman lasers 53 photorefractive 53 solder mask 53 porous substrates 53 nanometer nm CMOS 53 nm lithography 53 moisture absorption 53 Nanostructured 53 antifuse 53 micron 53 Tetra Reticle Clean 53 magnesium fluoride 53 Ultradur 53 CIGS solar 53 monolithic microwave integrated 53 VICTREX PEEK polymer 53 IGBT Insulated Gate 53 crosslinked 53 SIMOX 53 thermosetting resin 53 dielectric breakdown 53 antireflection coating 53 warpage 53 optical waveguide 53 GaN layer 53 electromigration 53 battery anodes 53 UMC #nm 53 capacitors inductors 53 strontium titanate 53 Silterra Malaysia Sdn 53 epoxy matrix 53 BiFET 53 transistor circuits 53 dilute nitride 53 silicon waveguide 53 silicon photonic 53 epiwafer 53 EPDM rubber 53 doped silicon 53 cadmium telluride CdTe 52 cordierite 52 DongbuAnam 52 VICTREX PEEK 52 Insulator 52 Halloysite 52 ferromagnetic 52 silicone elastomers 52 Neopor 52 Metrology System 52 glass substrate 52 Lexan sheet 52 #μm [002] 52 thermosetting resins 52 nm CMOS 52 backsheet 52 Anti Reflective 52 Deep Reactive Ion Etching 52 crystalline Si 52 Sn Pb 52 polyolefin plastics 52 thixotropic 52 amorphous silicon 52 aluminum oxide 52 MWNT 52 Z Foil 52 nanometer nm 52 #um [001] 52 dielectric deposition 52 electroplated 52 ultraviolet curable 52 thermoforming 52 planar 52 interlayers 52 bioactive glass 52 cadmium telluride 52 polysiloxane 52 uniaxial 52 CMOS logic 52 SnPb 52 serializer deserializer 52 laser scribing 52 #.# micron SiGe 52 silanes 52 lead zirconate titanate 52 copper indium gallium selenium 52 BiCMOS 52 thermal conductivities 52 alpha olefin 52 CVD etch 52 foil resistors 52 oxide nanoparticles 52 geogrid 52 SiC substrates 52 surface roughness 52 LTPS TFT 52 BJTs 52 HKMG 52 nanoengineered 52 silicon germanium SiGe BiCMOS 52 multilayer printed 52 pn junctions 52 SAC# 52 polymer fibers 52 thermally stable 52 Nanometer 52 #nm lithography [001] 52 cadmium sulfide 52 planar waveguide 52 ITO indium tin 52 composite laminates 52 resins additives 52 Germanium 52 subwavelength 52 nonmagnetic 52 solderable 52 passivation 52 bio absorbable 52 melt viscosity 52 dielectric strength 52 nanocoatings 52 Cerium oxide 52 polyolefin 52 filament winding 52 plywood particleboard 52 tensile strain 52 plasma etch 52 silicon nanoparticles 52 flexural strength 52 RT duroid 52 planar CMOS 52 crystalline silicon c 52 wide bandgap 52 polyvinylidene fluoride 52 perovskite 52 micron thick 52 Aerogels 52 thermally activated 52 silicon photovoltaics 52 manufacturability 52 multicrystalline silicon 52 hydrolytic stability 52 amorphous alloy transformer 52 solderability 52 conventional photolithography 52 GLOBALFOUNDRIES #nm 52 CIGS solar cells 52 tantalum ceramic aluminum 52 microfabricated 52 aluminum electrolytic capacitors 52 micromachined 52 Through Silicon Vias 52 GaAs substrate 52 electroforming 52 voltage CMOS 52 SiGe 52 fxP 52 Applied Baccini 52 non wovens 52 metalorganic chemical vapor deposition 52 CIGS photovoltaic PV 52 Copper Indium Gallium Selenide 52 nanoribbons 52 transistor 52 Ferrite 52 silicon nanowire 52 Hytrel 52 silicon etch 52 nanocomposite coatings 52 ferro electric 52 flowability 52 undoped 52 roughening 52 #.#mm thick [002] 52 exotic alloys 52 conformal coating 52 Celstran 52 high-k/metal gate HKMG 52 roofing membranes 52 insulating substrate 52 pultrusion 52 Gallium Arsenide 52 #nm #nm [002] 52 high voltage BCDMOS 52 TSV metallization 52 hydroxyapatite 52 expandable polystyrene EPS 52 parasitic inductance 52 nanopowder 52 Tetratex 52 aluminosilicate 52 Aluminum Oxide 52 gallium phosphide 52 HTS wires 52 HVPE 52 crystalline silicon 52 solder joints 52 flame retardancy 52 brazing alloys 52 QPAC ® 52 monofilaments 52 DS DBR 52 hafnium dioxide 52 GaAs pHEMT 52 indium gallium nitride InGaN 52 deep submicron 52 organic inorganic 52 mesoporous 52 thermoset composites 52 Boron Nitride 52 DURABIS 52 Selective Laser Sintering SLS 52 TiO 2 52 alumina ceramic 52 zinc selenide 52 osteoconductive 52 polymer nanocomposites 52 polycarbonate resins 52 deep silicon etch 52 multijunction solar cells 52 Cadmium Telluride 52 CMOS Silicon 52 gallium arsenide 52 thermoplastic resin 52 static dissipative 52 nanocomposites 52 wafer bumping 52 resists corrosion 52 compressive strain 51 Metallization 51 epi wafers 51 SiC wafers 51 rigid foam insulation 51 CMOS wafers 51 pyrogenic silica 51 Ruthenium 51 parametric yield 51 laminates 51 PolyMax 51 Stanyl ® 51 numerical aperture NA 51 graphene layers 51 gelation 51 RRAM 51 EUV resists 51 fiber reinforced thermoplastic 51 X7R 51 PIN diode 51 molybdenum disulfide 51 epitaxial wafers 51 polymer emulsion 51 high-k/metal-gate 51 microns thick 51 microvia 51 polyurethane elastomer 51 polyimides 51 polyisocyanurate insulation 51 acrylic polymers 51 piezo actuators 51 ultrathin 51 PIN diodes 51 nanostructured silicon 51 indium arsenide 51 laminate substrates 51 QMEMS 51 cadmium selenium 51 graphite oxide 51 TSMC #nm [001] 51 rigid substrate 51 copper nanorods 51 wettability 51 liquid crystalline 51 Nanotube 51 Hastelloy C 51 carbon nanotube 51 rigid polyurethane foam 51 tensile modulus 51 sintered metal 51 flux residues 51 antireflective coatings 51 geogrids 51 aramid 51 anisotropic 51 fluoropolymer coatings 51 ULTEM 51 borosilicate glass 51 polyaniline 51 multichip 51 poly crystalline 51 lamination 51 CdTe thin film 51 CMOS circuits 51 heavy fermion 51 phototransistors 51 indium antimonide 51 triacetate 51 Cree GaN 51 bandgap 51 semiconductor nanostructures 51 semiconducting material 51 rubbery polymer 51 Si SiGe 51 acrylic emulsion 51 nanoparticulate 51 SiGen 51 electrowinning 51 corrugation 51 surface passivation 51 naturally occurring nanotubes 51 nm wavelengths 51 microcavities 51 Stanyl 51 InP 51 nanosized 51 polymethylmethacrylate PMMA 51 chemically resistant 51 Oxide Silicon 51 tantalum capacitor 51 Czochralski 51 solder paste 51 CIGS 51 inorganic semiconductors 51 polymers 51 Zytel ® 51 nickel titanium alloy 51 Victrex PEEK 51 nanostructuring 51 regrind 51 thermal conduction 51 nanodots 51 GaAs InP 51 MgB2 51 microcellular 51 coating 51 extreme ultraviolet lithography 51 silicone rubber 51 gallium indium phosphide