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(Click for frequent words.) 72 EUV lithography 71 #nm immersion 71 nm lithography 70 #nm node [001] 70 optical lithography 69 nm immersion 69 lithography 68 nm node 68 ArF immersion lithography 68 EUVL 66 ArF 66 computational lithography 66 EUV 65 extreme ultraviolet lithography 64 #nm lithography [001] 63 extreme ultraviolet EUV 63 nano imprint 63 high-k/metal gate 63 nanoimprint 63 imprint lithography 63 #nm immersion lithography 62 photolithography 62 EUV resists 62 #nm [001] 62 photoresists 61 #nm CMOS [001] 61 low k dielectrics 61 nm immersion lithography 61 e beam lithography 60 TSVs 60 #nm nodes 60 silicon germanium 60 nanometer node 60 #/#nm 60 k dielectrics 60 SEMATECH 60 epitaxy 60 SOI CMOS 60 nanolithography 59 ITRS roadmap 59 nanometer 59 EUV mask 59 #nm silicon 59 SiGe 59 DUV 59 Lithography 59 #.#μm [002] 58 nano imprint lithography 58 silicon germanium SiGe 58 copper interconnects 58 wafer bonding 58 ArF immersion 58 CMOS fabrication 58 maskless lithography 58 SiON 58 k dielectric 58 Photolithography 58 photoresist 58 XT #i 58 mm wafer 58 #nm #nm [005] 58 SiC 58 wafer thinning 58 numerical aperture NA 57 Gigaphoton 57 Immersion Lithography 57 3D TSV 57 UV NIL 57 Molecular Imprints 57 TFPV 57 Silicon CMOS Photonics 57 Immersion lithography 57 #.# micron node 57 #mm wafer 57 nm nodes 57 nm CMOS process 57 immersion litho 57 k gate dielectric 57 through silicon vias 57 BEOL 57 HKMG 57 millisecond annealing 57 gate dielectrics 57 photomask 57 SUSS MicroTec 57 micro machining 57 gallium nitride 56 projected capacitive touch 56 WLCSP 56 Tachyon OPC + 56 nm CMOS 56 #mm wafers 56 semiconductor fabrication 56 deep ultraviolet DUV 56 TSMC #nm [001] 56 XLR #i 56 TSMC #nm process 56 microlithography 56 semiconductor lithography 56 sol gel 56 CMOS transistors 56 LTPS 56 MOS transistors 56 nanometer CMOS 56 smaller geometries 56 NSR S#C 56 InGaAs 56 #nm ArF 56 CMOS processes 56 defectivity 56 BiCMOS 56 K dielectrics 56 x ray optics 56 numerical aperture 56 CMOS 56 argon fluoride 56 dielectric etch 56 FinFET 56 metallization 56 amorphous silicon Si 56 package SiP 55 SOI wafers 55 #nm SOI 55 photomasks 55 underfill 55 silicon photonics 55 nanoimprinting 55 #nm [002] 55 silicon 55 DongbuAnam 55 Extreme Ultraviolet EUV 55 Silicon Via TSV 55 high-k/metal-gate 55 FEOL 55 mm wafers 55 Double Patterning 55 GaN 55 sSOI 55 MOCVD 55 defect densities 55 Aerosol Jet 55 oxide semiconductor 55 micromachining 55 IEDM 55 TWINSCAN XT #i 55 deep sub micron 55 nitride 55 FeRAM 55 .# micron 55 wafer bumping 55 CIGS 55 CMOS scaling 55 insulator SOI 55 3Xnm 54 Novellus 54 microfabrication 54 k gate dielectrics 54 EUV resist 54 substrates 54 wafer bonder 54 UVTP 54 solder paste 54 deep submicron CMOS 54 UV LED 54 plasma etch 54 pMOS 54 mask aligners 54 dielectrics 54 Complementary Metal Oxide Semiconductor 54 reticle inspection 54 line BEOL 54 2Xnm 54 nanopatterning 54 HKMG technology 54 #nm DRAM 54 FinFETs 54 semiconductor 54 Buried Wordline technology 54 nanometer silicon 54 photodetectors 54 nanoimprint lithography 54 submicron 54 Richard Brilla CNSE 54 planarization 54 indium tin oxide ITO 54 wafer 54 reactive ion 54 #nm HKMG 54 BCDMOS 54 semiconductor metrology 54 nm 54 Sematech 54 SOI substrates 54 photolithographic 54 micro optics 54 Imprio 54 VCSELs 54 nickel silicide 54 Crolles2 54 transistor scaling 54 C4NP 54 wirebond 54 planar CMOS 54 VCSEL 54 extreme ultra violet 54 nanoimprint lithography NIL 54 wafer dicing 54 Flip Chip 54 micromirror 54 ATopTech 53 SOI wafer 53 mask optimization SMO 53 Rapid prototyping 53 silicon MEMS 53 low k dielectric 53 MALDI 53 EUV masks 53 CIGS cells 53 SiGen 53 overlay metrology 53 Crolles2 Alliance 53 electrodeposition 53 high voltage BCDMOS 53 CIGS solar cells 53 CMOS MEMS 53 #nm CMOS [002] 53 solder bump 53 FD SOI 53 High Voltage CMOS 53 nano patterning 53 LCOS 53 Insulator SOI 53 millimeter silicon wafers 53 DPSS lasers 53 #.# micron CMOS 53 solder bumping 53 inkjet printing 53 PROLITH 53 RFCMOS 53 silicon etch 53 CMOS logic 53 Indium Phosphide 53 OLED displays 53 pHEMT 53 lithographic techniques 53 electron mobility 53 backside illumination 53 FDSOI 53 GaN substrates 53 silicon wafer 53 #nm wavelength [001] 53 millimeter wafer 53 #nm/#nm 53 nanometer nm 53 pellicle 53 MOS transistor 53 microchannel plate 53 XDR DRAM 53 Silicon Photonics 53 flexible substrates 53 laterally diffused metal 53 perpendicular recording 53 optical metrology 53 Affinity Biosensors 53 TQP# 53 microbolometer 53 AlN 53 TSMC Hsinchu Taiwan 53 metallisation 53 Clear Shape 53 ASML 53 microbolometers 52 Strained silicon 52 SIMOX 52 bipolar transistors 52 photonic devices 52 #nm RF CMOS 52 Flex OneNAND 52 TCZ 52 Alchimer 52 GaN HEMT 52 nonpolar GaN 52 epitaxy HVPE 52 gallium nitride GaN 52 micron 52 deep submicron 52 glass substrate 52 optical interconnect 52 copper metallization 52 selective emitter 52 nm NAND 52 heterostructure 52 ALLVIA 52 Nanochip 52 insulator wafers 52 optical coatings 52 Novellus SABRE 52 photoresist strip 52 indium phosphide InP 52 optical waveguides 52 RF CMOS 52 EVG# 52 SiP 52 Silicon Germanium 52 ion implantation 52 epitaxial 52 #nm Buried Wordline 52 monolithic microwave integrated 52 brightness LED 52 microfluidics 52 RRAM 52 #μm thick [002] 52 coater developer 52 eWLB 52 #mm fabs 52 Nanometer 52 amorphous silicon 52 epiwafers 52 optical microscopy 52 nanometer lithography 52 Luxtera 52 mm fab 52 Gallium Nitride 52 Carbon nanotube 52 numerical apertures 52 fabs 52 glass substrates 52 nanoelectronic 52 silicon CMOS 52 nm wavelengths 52 CMOS compatible 52 reconfigurable computing 52 semiconductor fabs 52 #nm MirrorBit 52 #mm fab 52 CMOS photonics 52 InP 52 holographic storage 52 lithographic 52 silicon substrates 52 #nm fab 52 active matrix OLED 52 #mm silicon wafers 52 SPIE Advanced Lithography 52 transparent conductive 52 nanosilicon 51 PHEMT 51 hydride vapor phase 51 wafer processing 51 Brion Technologies 51 physical vapor deposition 51 silicon foundries 51 dual damascene 51 CMOS oscillators 51 #nm MLC 51 wafer probing 51 vertical cavity 51 SiC substrates 51 nanofilm 51 nMOS 51 irreversible electroporation IRE 51 VUV 51 sputter deposition 51 HEMT 51 Mbit MRAM 51 TSMC 51 indium gallium arsenide InGaAs 51 dielectric materials 51 LiNbO3 51 transistor leakage 51 semiconductor wafer 51 SiliconBlue 51 MEMS 51 silicon waveguide 51 polishing pads 51 c Si 51 WiMAX chipset 51 Nova NanoSEM 51 extendibility 51 #.#μ 51 transistor 51 scanning electron microscope SEM 51 IMEC 51 OneChip 51 vapor deposition 51 ownership CoO 51 multijunction solar cells 51 #nm FPGAs 51 nanomanufacturing 51 indium phosphide 51 GaAs 51 Photomask 51 carbon nanotubes CNT 51 nm DRAM 51 crystalline Si 51 argon fluoride ArF 51 litho 51 Picolight 51 HEMTs 51 nanophotonic 51 conductive polymer 51 GX# [003] 51 eWLB technology 51 multichip 51 Wafer Level Chip 51 KrF 51 LTPS LCD 51 reticle enhancement 51 VECTOR Express 51 2Gb DDR3 51 nm geometries 51 #.#um [002] 51 inertial MEMS 51 OptoCooler 51 ARM#EJ processor 51 wafer thickness 51 CIGS thin film 51 UV LEDs 51 maskless 51 inkjet printhead 51 eutectic 51 photonic integration 51 double patterning lithography 51 HBLED 51 transistor arrays 51 picosecond lasers 51 engineered substrates 51 nanoscale characterization 51 #nm photomask 50 CMOS wafer 50 TWINSCAN 50 AlGaN 50 correction OPC 50 DFEB 50 PECVD 50 encapsulant 50 Nextreme 50 nanocomposites 50 plasma etching 50 wafer metrology 50 sub micron 50 Aixtron MOCVD 50 ReRAM 50 X ray microscopy 50 InGaP HBT 50 DiCon 50 wirebonding 50 TFTs 50 #.#um [001] 50 MetaRAM 50 Wafer Level Packaging 50 SiC Schottky diodes 50 finFETs 50 CMOS sensors 50 MRAMs 50 InGaN 50 microvia 50 lithography simulation 50 SUSS 50 optoelectronic 50 Esatto Technology 50 CVD diamond 50 SiTime 50 #LP [002] 50 microfocus X ray 50 oxide thickness 50 NAND Flash 50 TWINSCAN NXT 50 ANTARIS 4 50 UVision 50 mmWave 50 density NAND flash 50 manufacturability DFM 50 millisecond anneal 50 UniPixel 50 NiSi 50 CMP slurries 50 OLED 50 Si TFT LCD 50 #.#μm CMOS process 50 microfluidic 50 density interconnect HDI 50 CMOS silicon 50 scatterometry 50 NexFlash 50 TestKompress 50 #nm node [002] 50 CIGS solar 50 antireflective coatings 50 mechanical polishing CMP 50 CMOS IC 50 QMEMS 50 oxynitride 50 metrology 50 microelectromechanical systems MEMS 50 ITRS 50 pulsed laser deposition 50 Altera FPGAs 50 HVPE 50 Gallium Arsenide GaAs 50 Silicon Germanium SiGe 50 UV curable 50 CMOS RF CMOS 50 mm fabs 50 MEMS oscillator 50 SOI substrate 50 CMP consumables 50 Macronix 50 packaging WLP 50 ML#Q# 50 substrate 50 EBDW 50 femtosecond laser pulses 50 Airborne Particle Sensor 50 SiO 2 50 VIISta 50 sapphire substrate 50 SiGe BiCMOS 50 CMOS Photonics 50 Cortex A9 processor 50 Schottky 50 #.#nm [002] 50 Cree GaN 50 GaAs HBT 50 HORIBA Jobin Yvon 50 Surfect 50 #/#-nanometer 50 #nm fabrication 50 Inkjet printing 50 SiGe bipolar 50 lithographic processes 50 zeolite membranes 50 GxT 50 stereolithography 50 MEMS fabrication 50 MAPPER 50 DDR3 chips 50 optical interconnects 50 Aera2 50 metallic nanoparticles 50 laser annealing 50 voltage CMOS 50 VLSI 50 AlN substrates 50 moviNAND 50 optical spectroscopy 50 Nanoimprint lithography 50 poly silicon 50 antifuse 50 nanophotonics 50 laser sintering 50 PolyMax 50 crystalline silicon c 50 photovoltaic module 50 NANOIDENT 50 LSA#A 50 manufacturable 50 NuFlare 50 geometries shrink 50 Silicon photonics 50 photon detection 50 capacitive touch panels 50 linewidths 50 ultrasonic welding 50 Strained Silicon 50 epi wafers 50 LED backlights 50 nanometer chips 50 nm SOI 50 microdisplay 50 LTPS TFT 50 poly Si 50 OCD metrology 50 porous silicon 50 atomic spectroscopy 50 flexible monolithically integrated 50 GaAs substrates 50 Ziptronix 50 silicide 50 Cymer 50 Tetra Reticle Clean 49 tunable RF 49 CIGSe 49 UMC #nm 49 PolyJet Matrix TM 49 backside illumination BSI 49 JFET 49 Litho Forum 49 Tony Massimini chief 49 parametric yield 49 laser micromachining 49 quantum dot lasers 49 organic TFTs 49 nanocomposite material 49 GDDR4 49 CIGS PV 49 phototransistors 49 gate electrode 49 FPGA architectures 49 ion implanters 49 triplexer 49 SABRE 3D 49 NXT #i 49 hafnium oxide 49 Gallium Arsenide 49 magnetron sputtering 49 photoluminescence 49 diffraction limit 49 1Gbit DDR2 49 micromechanics 49 TDK EPC 49 #nm SoC 49 DRIE 49 epitaxial layer 49 Silicon Via 49 MEMS microelectromechanical systems 49 SHELLCASE 49 Phoseon 49 IGBT Insulated Gate 49 absorption spectroscopy 49 graphene transistors 49 inkjet inks 49 aluminum nitride 49 chipmaking 49 silicon photovoltaics 49 stencil printing 49 nanometrology 49 wide bandgap 49 #nm NAND flash 49 SiC wafers 49 chipmakers 49 electrowetting displays 49 high-k/metal gate HKMG 49 GaN transistor 49 Kovio 49 #G DQPSK 49 parasitic capacitance 49 laser triangulation 49 conductive inks 49 etch deposition 49 CoO 49 silicon Si 49 IC packaging 49 OTFT 49 FUSI 49 nitride semiconductor 49 #nm processors 49 dielectric constant 49 CdTe PV 49 brightness light emitting 49 NOR Flash memory 49 annealing 49 Luminescent Technologies 49 8bit MCUs 49 nanometer NAND flash 49 inch wafer fabs 49 #nm nanometer 49 FB DIMM 49 Eudyna 49 DFM DFY 49 #nm MLC NAND 49 mask ROM 49 wafer fabrication 49 MAX# integrates 49 ion beam 49 holistic lithography 49 DDR2 DRAM 49 Grätzel cells 49 HfSiON 49 PeakView 49 laser scribing 49 design kits PDKs 49 insulator substrate 49 PenTile 49 Rambus XDR 49 UV lasers 49 crystalline silicon solar 49 imec 49 Microdisplay 49 productization 49 TM# [002] 49 CMOS transistor 49 EasyTube ™ 49 deep silicon etch 49 brightfield 49 RF MEMS 49 emitting laser VCSEL 49 DRAM SRAM 49 Dresden fab 49 LedEngin 49 insulator SOI technology 49 IMFT 49 Si substrates 49 semiconducting materials 49 electron optics 49 cathode materials 49 NOVeA 49 HDP CVD 49 SVTC 49 S#C# 49 nanometer scale 49 configurable processor 49 SOI silicon 49 fxP 49 conformal coating 49 Raman spectroscopy 49 SMIC #.#um 49 fab lite strategy 49 ViSmart viscosity sensor 49 MirrorBit Quad 49 optocoupler 49 transistor circuits 49 TSMC Fab 49 fpgas 49 FUJIFILM Dimatix 49 Stratix II 49 interposers 49 Z RAM 49 ARM# MPCore processor 49 nano fabrication 49 #.#um CMOS 49 ion implant 49 ECPR 49 darkfield 49 perpendicular magnetic recording 49 layer deposition ALD 49 8Gbit 49 Phison 49 AMLCD 49 ceramic capacitor 49 etching DRIE 49 multilayer ceramic capacitors 49 printable electronics 49 Oerlikon Solar 49 semiconductor wafers 48 photodiode 48 SiGe C 48 mm wafer fab 48 Helios XP 48 Cadmium Telluride CdTe 48 tunable laser 48 AquiVia 48 fiber lasers 48 #um [002] 48 Terahertz 48 fab utilization 48 Diodes OLED 48 EUV Lithography 48 QCLs 48 line FEOL 48 TLA# Series 48 TFT LCD modules 48 micromorph 48 passivation 48 multicore architecture 48 electron beam welding 48 Schottky diode 48 EMCCD 48 eG ViaCoat 48 inch wafers 48 carbon nanotube CNT 48 optical transceiver 48 BCSM# 48 ferroelectric random access 48 GLOBALFOUNDRIES 48 electron beam lithography 48 HTPS panels 48 epiwafer 48 #nm chips 48 uniaxial strain 48 nanoscale 48 SEMICON West 48 Silicon Carbide 48 Texas Instruments DLP 48 TMOS display 48 silicon wafers 48 POWER5 + processor 48 BrightLase 48 nanofluidics 48 GaN wafer 48 #nm 8GB 48 planar transistors 48 laser diode 48 spectroscopic methods 48 Honeywell Electronic Materials 48 superlens 48 Gallium arsenide 48 copper indium gallium selenide 48 LDMOS 48 nanocrystal 48 5V CMOS 48 AlGaAs 48 hafnium 48 Organic Light Emitting 48 OLED microdisplay 48 electro optic polymer 48 RV# GPU 48 Zroute 48 CIGS copper indium 48 passive matrix OLEDs 48 nanofabrication techniques 48 embedded NVM 48 SiliconSmart ACE 48 epitaxial layers 48 CMOS ICs 48 nanoscale patterning 48 CRIUS 48 topological insulators 48 thinner wafers 48 PowerTheater 48 GX FPGAs 48 Oxide Silicon 48 CMOS imagers 48 STT RAM 48 patterning 48 AFMs 48 CyberDisplay #K 48 solventless 48 NEXX Systems 48 #nm lithography [002] 48 Helios NanoLab 48 silicon transistors 48 FusionQuad 48 Thinfilm 48 microelectronic packaging 48 TOF TOF 48 MEMS gyroscopes 48 triple quadrupole 48 MirrorBit Eclipse 48 UV curing 48 Kotura 48 2Gbit 48 excimer 48 Achronix 48 conformal coatings 48 Optima XE 48 XFP module 48 FineSim Pro 48 polycrystalline 48 magnetoresistive random access 48 wafer fabs 48 #nm SRAM 48 quantum cascade lasers 48 #mm wafer fab 48 DDR PHY 48 Manz Automation 48 FlexUPD 48 monochromator 48 embedded DRAM 48 colloidal silica 48 MLC NAND flash 48 optofluidic 48 ferroelectric 48 LayTec 48 planar 48 Cymbet 48 #G EPON 48 ASML TWINSCAN 48 microdisplays 48 microfluidic devices 48 programmable logic 48 photomask inspection 48 EO polymer 48 conductive adhesives 48 photoresist stripping 48 UltraCMOS 48 antireflection 48 Si substrate 48 multilayers 48 chip optical interconnects 48 carbon nanotube 48 gigabit Gb NAND flash 48 MirrorBit ORNAND 48 nanometer microprocessors 48 OLED lighting 48 photovoltaics PV 48 fluoropolymer 48 leadframe 48 photonic circuits 48 DEK Solar 48 SpyGlass ® 48 film transistors TFTs 48 Fujitsu Microelectronics 48 Gallium Nitride GaN 48 spectral imaging 48 Toppan Photomasks 48 TSV 48 nanometer nm NAND flash 48 LDMOS RF power 48 3D TSVs 48 Elpida #nm 48 rollable display 48 wafer foundries 48 anneal 48 laser diode modules 48 organic photovoltaics 48 BrilliantColor TM 48 Excelitas 48 Magma Talus 48 Fraunhofer IZM 48 tunable filters 48 microscopy techniques 48 Innolume 48 capacitive touch sensing 48 Indium phosphide 48 Opti Probe 48 laser welding 48 selective soldering 48 Virtex 5 48 Solamet ® 48 film transistor TFT 48 flexo printing 48 Aviza Technology 48 silicon substrate 48 QuantumFilm 48 temporary wafer bonding 48 TetraMAX ATPG 48 athermal 48 Kippelen 48 DLP Pico TM 48 #μm [002] 48 #mm MEMS 48 DDR3 DRAM 48 Austriamicrosystems 48 Control LACC 48 projected capacitive 48 ultraviolet lasers 48 nanometer nm CMOS 48 Epson Toyocom 48 Spintronics 48 WirelessHD chipsets 48 DDR NAND 48 structured ASICs 48 Mentor Graphics Calibre 48 Efficeon TM# processor 48 #nm #nm [002] 48 Transmeta Efficeon processor 48 Ball Grid Array 48 WiCkeD 48 Qcept 48 thermally conductive 48 DualBeam 48 MirrorBit NOR 48 CIS CIGS 48 SensArray 48 additive fabrication 48 Tokyo Electron Limited 48 di selenide CIGS 48 MEMS sensor 48 leakage currents 48 DDR3 48 plasmonics 48 photopolymer 48 AMD Fusion APUs 48 AMOLEDs 48 active matrix OLEDs 48 Gargini 48 InSb 48 optoelectronic packaging 48 LEXT 48 microreactors 48 Xpedion 48 Intel #P chipset [001] 48 logic NVM 48 mobileFPGA devices 48 diode pumped 48 Arria GX FPGAs 48 chemical mechanical planarization 48 Synopsys IC Compiler 48 X FAB 48 gate dielectric 47 CIGS solar cell 47 subwavelength 47 protein purification 47 nanopowders 47 nanoparticle inks 47 Through Silicon Vias 47 nanofabrication 47 2μm 47 DPSS laser 47 III nitride 47 #μm [001] 47 Alanod Solar 47 GenISys 47 interposer 47 silicon nanowire 47 embedded passives 47 silicon etching 47 manufacturability 47 photonic integrated circuits PICs 47 Calibre LFD 47 GaAs MMIC 47 encapsulants 47 Auria Solar 47 SilTerra 47 NAND Flash memory 47 #mm silicon wafer 47 selective laser sintering 47 resin infusion